Thermo-electric heat pump systems

ABSTRACT

The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 13/146,635, titled “Thermo-Electric Heat PumpSystems,” filed Feb. 8, 2012 (issued as U.S. Pat. No. 8,646,282), whichis the U.S. National Stage of PCT/US2010/022459, filed Jan. 28, 2010,entitled “Thermo-Electric Heat Pump Systems”, which is acontinuation-in-part of U.S. patent application Ser. No. 12/361,484filed Jan. 28, 2009, entitled “Thermo-Electric Heat Pump Systems”(issued as U.S. Pat. No. 8,677,767); International Application No.PCT/US2010/022459 also claims the benefit of U.S. ProvisionalApplication No. 61/148,911 filed Jan. 30, 2009, entitled“Thermo-Electric Heat Pump Systems,” the contents of each of which areincorporated herein by reference in their entireties.

BACKGROUND

This invention relates to thermo-electric heat pump systems. In anotheraspect, this invention relates to providing a system for improvediso-thermal transport and storage systems. More particularly, thisinvention relates to providing a system for temperature regulation fortransported materials requiring a stable thermal environment. There is aneed for a robust shock-proof and efficient thermo-electric device thatis self-sufficient and does not require external power for a period ofmultiple days. Further, there is a need for a thermo-electric devicethat is capable of safely storing and maintaining its cargo duringtransport and/or storage. The need for such an invention has beenexpressed by those involved in transportation and storage of temperaturesensitive and delicate goods, for example, biological or laboratorysamples. Additionally, this need is further expressed by thoseresponsible for transporting sensitive goods in extreme locations wheretemperature regulation may be problematic. Furthermore, a need existsfor an iso-thermal storage and transport system that self-regulatestemperature over pre-defined, adjustable cooling or heating profiles.Shipping weight and volume are also prime concerns.

A need exists for an iso-thermal storage and transport system thatprovides a self-contained means for storing energy onboard during thetransport and storage of sensitive goods, such as biological materialsand samples, including cell and tissue cultures, nucleic acids, bodilyfluids, tissues, organs, embryos, semen, stem-cells, ovaries, platelets,blood, plant tissues, and other sensitive goods such as pharmaceuticals,vaccines and chemicals. In light of available utilities, externalambient temperature, environmental conditions and other factors, it isessential that an iso-thermal storage and transport system functionreliably to protect sensitive goods from degradation.

A need exists for an iso-thermal storage and transport system that isrobust and that provides a shock-proof system that withstands abuses andrough handling inherent within storage and transportation of sensitivegoods.

Further, needs exist for iso-thermal storage and transport systems andother related thermo-electric heat pump systems that are reusable,reliable over an extended time period, cost-effective and dependable.

OBJECTS AND FEATURES OF THE INVENTION

A primary object and feature of the present invention is providing areliable, efficient iso-thermal system for protecting sensitive goodsduring storage and transport.

Another object and feature of the present invention is providing areliable, efficient iso-thermal system having high coefficients ofperformance (hereinafter “COP”) for efficient performance for protectingsensitive goods during storage and transport.

A further object and feature of the present invention is makingstreamlined use of the thermo-electric effect (the direct conversion oftemperature differences to electric voltage), and conversely, convertingelectric voltage to temperature differences for protecting sensitivegoods during storage and transport.

Another object and feature of the present invention is making aconvenient and accurate temperature controller wherein heat may bepumped, either into or out of a vessel, so as to maintain temperatureconsistency within the vessel for protecting sensitive goods duringstorage and transport.

Yet another object and feature of the present invention is utilizing theSeebeck and Peltier principles for protecting sensitive goods duringstorage and transport.

Another object and feature of the present invention is minimizingshipping volume and weight while functionally providing neededtemperature regulation for protecting sensitive goods during storage andtransport.

Yet another object and feature of the present invention is providing ahigh degree of efficiency and reliability for protecting sensitive goodsduring storage and transport.

Another object and feature of the present invention is providing aniso-thermal storage and transport system that self-regulates temperatureover pre-defined, adjustable cooling or heating profiles.

Another object and feature of the present invention is providing onboardstored energy, such as direct-current rechargeable batteries andrecharging system, for supplying required power for protecting sensitivegoods during storage and transport.

Another object and feature of the present invention is method ofengineering design of thermo-electric heat pumps, relating to designingtoward maximizing heat pumped per unit of input power.

Another object and feature of the present invention is method ofengineering design of thermo-electric heat pumps, relating to designingtoward maximizing heat pumped per unit of input power, applied toshipping perishables.

Another object and feature of the present invention is method ofengineering design of thermo-electric heat pumps, relating to designingtoward heat removal requirements of a specific use so as to reduce powerrequirements.

Another object and feature of the present invention is method ofengineering design of thermo-electric heat pumps, relating to designingtoward maximizing heat pumped per unit of input power, providingtemperature conditioning of perishables in recreational vehicles,including marine vehicles.

Another object and feature of the present invention is method ofengineering design of thermo-electric heat pumps, relating to designingtoward maximizing heat pumped per unit of input power, protectivelytransporting reproductive biological material, including equine semen,bovine semen, or other mammalian reproductive biological material.

SUMMARY OF THE INVENTION

The present invention is directed to a thermoelectric heat pump assemblyhaving a more efficient design. As used herein, Temperature (T) is inCelsius; Voltage (V) is in Volts; current (I) is in Amps; heat (Q) is inWatts; and resistance R is in Ohms. The heat pump assembly designsdescribed herein increases heat pump per unit of input power duringoverall use, with increased reliability. In a preferred embodiment thethermoelectric heat pump assembly comprises: two or more thermoelectricunit layers (i.e., thermoelectric modules) capable of active use of thePeltier effect, each thermoelectric unit layer having a cold side and ahot side, and at least one capacitance spacer block suitable for storingheat and providing a delayed thermal reaction time of the assembly.

Preferably, the heat pump assembly of the invention is configured sothat each thermoelectric unit layer at steady-state during operation hasratio of the heat removed divided by the input power (COP) that is priorto and less than the peak COP on a COP curve of performance (See FIGS.29A-C and 30A-C). The capacitance spacer block has a top portion and abottom portion and is between a first thermoelectric unit layer and asecond thermoelectric layer. The top portion of the capacitance spacerblock is thermally connected to the hot side of the first thermoelectricunit layer and the bottom portion is thermally connected to the coldside of the second thermoelectric unit layer, forming a sandwich layersuitable to pump heat from the first thermoelectric unit layer to thesecond thermoelectric layer. Preferably, the capacitance spacer block ismade of copper, aluminum, or other thermally conductive and capacitivealloys.

Each thermoelectric unit layer preferably comprises thermoelectric unitselectrically connected in parallel or series, but thermally connected inseries. Preferably, each thermoelectric unit layer in the heat pumpassembly is separated by a capacitance spacer block. In preferredconfigurations, the thermoelectric heat pump of the invention would havetwo to nine thermoelectric unit layers (e.g., 2, 3, 4, 5, 6, 7, 8, 9).The thermoelectric unit layers are preferably electricallyreconfigurably connected to maintain a preferred temperature profileover time by switching between different configurations, e.g.,electrically reconfigurable between series and parallel configurations.

At least one energy source (e.g., battery) is operably connected to eachthermoelectric unit layer, wherein the energy source is suitable toprovide a current to power the thermoelectric heat pump and to controlthe amount of heat removed by the heat pump. In certain aspects of theinvention, the heat pump assembly comprises two or more energy sources(e.g., 3, 4, 5) that can be used as back up or provide alternativecurrent configurations.

Advantageously, the heat pump assembly typically also has a heat sinkassociated with a fan assembly, wherein in the heat sink is thermallyconnected at the bottom end of the heat pump assembly. In certainaspects of the invention, the heat sink is at least 30 W, morepreferably at least 40 W (e.g., 45 W, or 50 W).

In one aspect of the invention, the heat pump assembly is configured sothat each individual thermoelectric unit layer has a ratio of inputcurrent to maximum available current (I/Imax) of 0.35 at steady-state.More preferably the heat pump assembly is configured so that the I/Imaxof 0.09 or less (e.g. 0.076) at a steady-state, when change intemperature (ΔT) of the heat pump assembly at the top end compared tothe bottom end of the heat pump assembly is about 20° C. and heatremoval (Q) is about 0 Watts; and/or the ratio of input current tomaximum available current (I/Imax) of each individual thermoelectricunit layer is 0.18 or less at a steady-state, when change in temperature(ΔT) of the heat pump assembly at the top end compared to the bottom endof the heat pump assembly is about 40° C. and heat (Q) is about 0 Watts.

In another aspect of the invention, the heat pump assembly is configuredso that each individual thermoelectric unit layer has a maximum changein temperature (ΔTmax) potential and comprises at least 127 coupledpairs of thermoelectric units, and wherein the heat pump assembly isconfigured so that each thermoelectric layer operates at: (i) less than20% of the ΔTmax at steady-state when change in temperature (ΔT) of theheat pump assembly at the top end compared to the bottom end of the heatpump assembly is about 20° C.; and/or (ii) less than 40% of the ΔTmax atsteady-state when change in temperature (ΔT) of the heat pump assemblyat the top end compared to the bottom end of the heat pump assembly isabout 40° C.

In another aspect of the invention, the heat pump assembly furthercomprises a heat sink associated with a fan assembly, wherein in theheat sink is thermally connected at the bottom end of the heat pumpassembly, the heat pump assembly being configured to minimize atemperature rise or drop on the heat sink at a steady-state so that thetemperature rise or drop on the heat sink does not exceed 5° C., morepreferably it does not exceed 4° C. or 3° C., and most preferably 2.5°C., typically as compared to ambient temperature.

In a preferred configuration, the thermoelectric heat pump assembly isconfigured so that at steady-state the heat sink has a temperature thatdoes not exceed 30%, more preferably 25% or 20%, of the heat sinkmaximum temperature rating, wherein the heat sink has a rating of atleast 35 Watts (e.g., 40 Watts).

It is preferred that each thermoelectric unit layer comprise at least127 coupled pairs of thermoelectric units. Also, is preferable that eachthermoelectric unit layer is 3 or more Ohms at 25° Celsius, morepreferably 5 or more Ohms, (e.g. about 5.5, 6.0, or 6.5 Ohms), typicallynot greater than 7.5 Ohms. The preferred thermoelectric unit layer(i.e., a thermoelectric module) has a heat pumping capability of between15 Watts and 20 Watts.

Preferably, each thermoelectric unit layer has a maximum change intemperature (ΔTmax) potential and is configured so that eachthermoelectric layer operates at less than 20% of the ΔTmax atsteady-state when change in temperature (ΔT) of the heat pump assemblyat the top end compared to the bottom end of the heat pump assembly is20° C.; and/or operates at less than 40% of the ΔTmax at steady-statewhen change in temperature (ΔT) of the heat pump assembly at the top endcompared to the bottom end of the heat pump assembly is 40° C.

In addition, preferably the capacitance spacer block typically separatesthe thermoelectric unit layers by at least ¼ inch, more preferably atleast about ½, 1, 2, or 3 inches. In a specific design of the invention,the capacitance spacer block, is about 1.5-2.5 inches. Preferably, thetop portion and bottom portion of the capacitance spacer block issubstantially the same size and shape as the cold side and hot side ofeach thermoelectric unit layer to obtain substantial contact with thethermoelectric unit layer.

The thermoelectric heat pump assembly of the invention may furthercomprise momentary relay based circuitry, preferably programmable by aportable microprocessor adapted to control the temperature of thetemperature sensitive goods based on a preferred temperature profile. Ina preferred embodiment of the invention, the thermoelectric heat pumpassembly further comprises a microcontroller (e.g., microprocessor)operatively associated with the energy source and at least one relay,wherein the microcontroller activates the at least one relay whichdirects current from the energy source to at least one of thethermoelectric unit layers and wherein the at least one relay reconnectsthe at least one thermoelectric unit layer in series or parallel withanother thermoelectric unit layer.

For example, the microcontroller: (1) defines a setpoint temperature(Tsp) and compares the Tsp to a temperature (Tc) of a containeroperatively associated with the thermoelectric heat pump assembly,wherein the microcontroller controls at least one relay to connect theat least one thermoelectric unit layer in series if Tc checks positiveor equal against Tsp, and wherein the microcontroller deactivates the atleast one relay if Tsp checks negative or equal against Tc; (2) definesa Tsp and compares the Tsp to Tc of a container operatively associatedwith the thermoelectric heat pump assembly, wherein the microcontrolleractivates the at least one relay to connect the at least onethermoelectric unit layer in parallel if Tc checks positive or equalagainst Tsp, and wherein the microcontroller deactivates the at leastone relay if Tsp checks negative or equal against Tc; and/or (3) definesa Tsp and compares the Tsp to a Tc of a container operatively associatedwith the thermoelectric heat pump assembly, wherein the microcontrolleractivates the at least one relay to connect the at least onethermoelectric unit layer in parallel and the microcontroller activatesthe at least one relay to connect the at least one thermoelectric unitlayer in series if Tsp checks positive or equal against Tc, and whereinthe microcontroller deactivates the at least one relay if Tsp checksnegative or equal against Tc. In a specific example, the Tc would checkpositive or equal if the Tc is greater than the Tsp plus 1° C., morepreferably 0.5° C., or a most preferably 0.1° C.

The invention is further directed to a thermoelectric transport orstorage device for thermally protecting temperature sensitive goodsduring transport. Preferably the thermoelectric transport and storagedevice is configured so that it self-regulates temperature overpre-defined, adjustable cooling or heating profile. Advantageously, thedevice comprises a thermal isolation chamber for storing the temperaturesensitive goods and at least one thermoelectric heat pump assembly, asdescribed herein, thermally connected to the thermal isolation chamberand configured to control a temperature of the temperature sensitivegoods during transport or storage at a selected steady-state temperaturewithin a tolerable temperature variation for the temperature sensitivegoods being transported or stored. Preferably the thermal isolationchamber is made of thermally conductive metals and alloys, e.g.,aluminum.

Non-limiting examples of temperature-sensitive goods suitable fortransport in the device include: semen, embryos, oocytes, cell cultures,tissue cultures, chondrocytes, nucleic acids, bodily fluids, organs,plant tissues, pharmaceuticals, vaccines, and temperature-sensitivechemicals. In a preferred embodiment the thermoelectric transport orstorage device also has a robust shock proof exterior, capable ofprotecting sensitive goods during long periods of transport and storage.

In certain aspects of the invention, the transport or storage devicetypically also has a portable microprocessor, wherein the portablemicroprocessor is programmed to communicate with the thermoelectrictransport or storage device upon activation. In addition, the device mayalso advantageously have an electrical-erasable-programmableread-only-memory (EEPROM) chip operatively associated with thethermoelectric transport or storage device. The EEPROM chip communicateswith the portable microprocessor and the thermoelectric heat pump. Theportable microprocessor also typically communicates with the EEPROM chipthrough a multi-master serial computer bus using I2C protocol andpreferably stores received time and temperature profiles related to thethermoelectric heat pump assembly.

In one exemplary configuration, the portable microprocessor communicatestime and temperature profiles related to the thermoelectric heat pump tothe EEPROM and also receives time and temperature profiles related tothe thermoelectric heat pump from the EEPROM. Preferably the portablemicroprocessor stores the received time and temperature profiles relatedto the thermoelectric heat pump. Also, the portable microprocessor ispreferably operatively associated with the thermoelectric transport orstorage device through one or more DB connectors. In this exemplaryembodiment, the portable microprocessor is often advantageouslyactivated by the energy source of the thermoelectric transport orstorage device.

The thermoelectric transport or storage device described herein, alsopreferably comprises reconfigurable circuitry suitable for a selectedtemperature input. In this embodiment, the thermoelectric unit layersare electrically reconfigurable to maintain a temperature profile duringtransport or storage. Typically, the circuitry comprises a programmablemicroprocessor programmed to actuate a temperature sensitive goodsspecific temperature profile.

The thermoelectric transport or storage device also preferably has atleast one rotator structured and arranged to rotate the temperaturesensitive goods within the thermal isolation chamber. This facilitates auniform temperature of the goods during transport and enhances theeffectiveness of maintaining the desired temperature.

The thermoelectric transport or storage device is also preferablyconfigured to configured to control the temperature of the temperaturesensitive goods within a selected tolerance for a specific temperaturesensitive good, for example, a tolerance of less than about 10° C., morepreferably less than: 8° C.; 5° C.; and/or 3° C.; and most preferablyless than: 1° C., 0.5° C. and/or 0.1° C.

Another aspect of the invention is the ability to program thethermoelectric transport or storage device with unique specific profilessuitable for the specific goods being transported and the needs of theusers. For example, the device can be programmed to ship reproductivefluids at a selected and desired temperature to best preserve the fluidsusing very low tolerance variability levels of 0.1° C., until delivery,at which the device would be programmed to increase to a second selectedand desired the temperature for clinical use.

Also with extremely sensitive temperature goods it is important to havea ramp down and/or ramp down period so as not to harm the goods due to arapid change in temperature. To ramp down/up the temperature, the devicecan be programmed or configured to gradually increase or decrease thetemperature over a set time period. For example, the device could beprogrammed to decrease/increase the temperature by 0.1 degrees every 20minutes, down to a selected temperature. Thus, as can be seen, thedevice of the invention provides the user with the ability tospecifically program the device with not just one profile, but withseveral temperature profiles (or sub-profiles), e.g., 3, 4, 5, etc. inaccordance with parameters of the goods to be stored or transported. Theactivation of sub-profiles allows for increased flexibility in bestprotecting the specific temperature sensitive goods during transport.

The thermoelectric transport or storage device advantageously has atleast one portable energy source, e.g. at least one, two, or threebatteries, which is suitable to maintain the selected temperature forthe temperature sensitive goods during transport of at least 72 hours,more preferably at least 84 hours, and even 7 days, the selectedtemperature of the temperature sensitive goods compared to ambienttemperature is at least 20° C., at least 30° C. or at least 40° C.Multiple batteries can be used to provide the necessary energy source.

Another important aspect of the invention is the insulation. Theinsulation preferably one or more vacuum insulators insulating thethermal isolation chamber. Preferred vacuum insulators comprise at leastone layer of reflective material having infrared emittance, in theinfrared spectrum from about one micron to about one millimeterwavelength, of less than about 0.1. Even more preferred, the vacuuminsulators also preferably comprise at least one evacuated volume havingan absolute pressure of less than about 10 Torr.

The thermoelectric transport or storage devices described herein cancome in many sizes and shapes, e.g., 1′×2; 4′×4′, etc. As the sizes ofthe transport or storage device increase it is preferably that at least2 thermoelectric heat pumps be incorporated therein (4, 8, 10, 15,etc.). The heat pumps are preferably reconfigurably connected betweenseries and parallel configurations. Furthermore, the thermoelectric unitlayers of each heat pump is also preferably reconfigurably connectedbetween series and parallel providing greater control over the amount ofheat generation of each thermoelectric unit layer and the heat pump ingeneral.

The invention is also directed to a method of safely transportingtemperature sensitive goods at a selected temperature profile duringtransport. The method preferably comprises the steps of:

-   -   (a) placing the temperature sensitive goods in a transportation        device adapted to thermally isolate the temperature sensitive        goods from outside environment, wherein the transportation        device comprises at least one temperature control system adapted        to actuate the selected temperature profile while the        temperature sensitive goods are in the transportation device,        the temperature control system comprising at least one        thermoelectric heat pump as described above in thermal        association with the temperature sensitive goods being        transported; and    -   (b) transporting the temperature sensitive goods while the        transportation device is activated according to the selected        temperature profile.

In certain embodiment, the invention further comprises loading auser-selected temperature profile specific to the temperature sensitivegoods being transported by inserting a smart chip into a communicationlink, wherein the smart chip downloads the profile into the transportdevice.

In accordance with a other preferred embodiments hereof, this inventionprovides a thermal protection system, relating to thermally protectingtemperature-sensitive goods, comprising: at least one thermo-electricheat pump adapted to control at least one temperature of thetemperature-sensitive goods; wherein such at least one thermo-electricheat pump comprises at least one thermo-electric device adapted toactive use of the Peltier effect; wherein such at least onethermo-electric heat pump comprises at least one thermal capacitoradapted to provide at least one thermal capacitance in thermalassociation with such at least one thermo-electric device; and whereinsuch at least one thermal capacitance is user-selected to provideintended thermal association with such at least one thermo-electricdevice, and wherein such at least one thermal capacitance is preferablyembodied by a capacitance spacer block made of, for example, aluminum,copper, or other thermally conductive and capacitive alloys. Moreover,it provides such a thermal protection system: wherein such intendedthermal association of such at least one least one thermal capacitanceis user-selected to provide increased energy efficiency of operation ofsuch at least one thermo-electric device as compared to such energyefficiency of operation of such at least one thermo-electric devicewithout addition of such at least one least one thermal capacitor.

Additionally, it provides such a thermal protection system: wherein suchintended thermal association of such at least one thermal capacitance isuser-selected to allow usage of momentary-relay-based control circuitryin combination with at least one energy store to power such at least onethermo-electric device to achieve control of at least one temperature ofthe temperature-sensitive goods. Also, it provides such a thermalprotection system: wherein such control of such at least one temperaturecomprises controlling such at least one temperature to within atolerance of less than about one degree centigrade. In addition, itprovides such a thermal protection system: wherein such intended thermalassociation is user-selected to control usage of proportional controlcircuitry in combination with at least one energy store to power such atleast one thermo-electric heat pump to control such at least onetemperature of the temperature-sensitive goods. And, it provides such athermal protection system: wherein such control of such at least onetemperature comprises controlling such at least one temperature towithin a tolerance of less then one degree centigrade. Further, itprovides such a thermal protection system: wherein such at least onethermo-electric heat pump comprises a minimum of one sandwich layer;wherein such sandwich layer comprises at least one set of suchthermo-electric devices and at least one set of such thermal capacitors;wherein each such sandwich layer is suitable for thermally-conductivelyconnecting to at least one other such sandwich layer; and whereinthermal conductance between essentially all such attached sandwichlayers is greater than 10 watts per meter per degree centigrade.

Even further, it provides such a thermal protection system: wherein suchat least one thermo-electric heat pump comprises at least one suchsandwich layer comprising such set of such thermo-electric devices;wherein each thermo-electric device comprising such plurality iselectrically connected in parallel with each other each thermo-electricdevice comprising such plurality; and wherein each set of suchthermo-electric devices comprising such first sandwich layer is suitablefor thermally-conductively connecting to at least one other suchsandwich layer; and wherein thermal conductance between essentially allsuch attached sandwich layers is greater than 10 watts per meter perdegree centigrade.

Moreover, it provides such a thermal protection system furthercomprising: at least one thermal isolator for thermally isolating thetemperature sensitive goods. Additionally, it provides such a thermalprotection system: at least one thermal isolator for thermally isolatingthe temperature sensitive goods, wherein such at least one thermalisolator comprises at least one vessel structured and arranged tocontain the temperature sensitive goods; and wherein such at least onevessel comprises at least one heat-transferring surface structured andarranged to conductively exchange heat to and from such at least onetemperature controller.

Also, it provides such a thermal protection system: wherein such atleast one vessel comprises at least one re-sealable surface structuredand arranged to ingress and egress the temperature sensitive goods toand from such at least one thermal isolator. In addition, it providessuch a thermal protection system: wherein such at least one re-sealablesurface comprises at least one seal structured and arranged to excludeat least one microorganism from such at least one vessel. And, itprovides such a thermal protection system: wherein such at least onethermal isolator comprises at least one insulator for insulating thetemperature sensitive goods. Further, it provides such a thermalprotection system: wherein such at least one insulator comprises atleast one layer of reflective material; and wherein infrared emittanceof such reflective material is less than about 0.1, in the infraredspectrum from about one micron to about one millimeter wavelength.

Even further, it provides such a thermal protection system: wherein suchat least one insulator comprises at least one evacuated volume; andwherein absolute pressure of such least one evacuated volume is lessthan about 10 Torr. Moreover, it provides such a thermal protectionsystem: wherein such at least one thermal isolator comprises at leastone goods rotator structured and arranged to rotate the temperaturesensitive goods within such at least one thermal isolator. Additionally,it provides such a thermal protection system: wherein such at least onegoods rotator is structured and arranged to self-power from at least oneenergy storage device.

Also, it provides such a thermal protection system: wherein such atleast one energy storage device comprises at least one battery. Inaddition, it provides such a thermal protection system: wherein suchthermo-electric heat pump comprises from about two to about nine vesselsandwich layers, each such vessel sandwich layer comprising at least onevessel set of such thermo-electric devices; and wherein such at leastone vessel set comprises at least two thermo-electric devices. And, itprovides such a thermal protection system: wherein such at least onevessel set comprises at least ten thermo-electric devices.

In accordance with another preferred embodiment hereof, this inventionprovides a method, relating to use of at least one thermal protectionsystem, relating to thermally protecting temperature-sensitive goods,comprising the steps of: delivery, by at least one provider, of such atleast one thermal protection system to at least one user, relating to atleast one use, relating to at least one time period; wherein such atleast one thermal protection system comprises at least onethermo-electric device adapted to active use of the Peltier effect toeffect such control of at least one temperature; wherein such at leastone thermo-electric device comprises at least one thermal capacitoradapted to provide at least one thermal capacitance in thermalassociation with such at least one thermo-electric device; and whereinsuch at least one thermal capacitor is user-selected to provide intendedthermal association with such at least one thermo-electric devicepresetting of at least one set-point temperature of such at least onethermal protection system, by such at least one provider, prior to suchdelivery; and receiving value from at least one party benefiting fromsuch at least one use. Further, it provides such a method, furthercomprising: providing re-use of such at least one thermal protectionsystem, by such at least one provider; wherein such step of providingre-use comprises at least one cleaning step, and at least one set-pointre-setting step. Even further, it provides such a method, furthercomprising: permitting other entities, for value, to provide suchmethod.

In accordance with another preferred embodiment hereof, this inventionprovides a method of engineering design of thermo-electric heat pumps,relating to designing toward maximizing heat pumped per unit of inputpower, comprising the steps of: accumulating at least one desired rangeof variables for each at least one design-goal element of suchthermo-electric heat pump to be designed; discovering such maximum heatpumped per unit of input power; and finalizing such engineering design;wherein such step of discovering such maximum heat pumped per unit ofinput power comprises providing at least one desired arrangement of aplurality of thermo-electric devices, wherein essentially eachthermo-electric device of such plurality of thermo-electric devices isassociated with at least one user selectable thermal capacitance,holding each such at least one design-goal element within a respectivesuch at least one desired range of variables, incrementally trialraising each such at least one user selectable thermal capacitance whileperforming such holding step, and essentially maximizing such at leastone user selectable thermal capacitance while remaining within eachrespective such at least one desired range of variables; wherein atleast one essentially maximum heat pumped per unit of input power may beachieved.

In accordance with another preferred embodiment hereof, this inventionprovides a method, applied to shipping perishables: wherein suchdesign-goal elements comprising ambient temperature, shipping containercost, shipping container weight, shipping container size, maximumvariation of temperature of perishables required; wherein the shippingcontainer cost, shipping container weight, shipping container size,variation of temperature of perishables are minimized while achievingessentially maximum heat pumped per unit of input power; wherein suchshipping container comprises at least one arrangement of a plurality ofthermo-electric devices; wherein essentially each thermo-electric deviceof such plurality of thermo-electric devices is associated with at leastone user selectable thermal capacitance; wherein thermal capacitance ofeach such at least one user selectable thermal capacitance is determinedby holding each such at least one design-goal element within arespective such at least one desired range of variables, incrementallytrial raising each such at least one user selectable thermal capacitancewhile performing such holding step, and essentially maximizing such atleast one user selectable thermal capacitance while remaining withineach respective such at least one desired range of variables; andwherein at least one essentially maximum heat pumped per unit of inputpower is achieved.

In accordance with another preferred embodiment hereof, this inventionprovides a method, applied to providing temperature conditioning ofperishables in recreational vehicles: wherein such design-goal elementscomprise ambient temperature, perishable cold storage container cost,perishable cold storage container weight, perishable cold storagecontainer size, maximum variation of temperature of perishablesrequired; wherein the cold storage container cost, perishable coldstorage container weight, perishable cold storage container size,variation of temperature of perishables are minimized while achievingessentially maximum heat pumped per unit of input power; wherein suchshipping container comprises at least one arrangement of a plurality ofthermo-electric devices; wherein essentially each thermo-electric deviceof such plurality of thermo-electric devices is associated with at leastone user selectable thermal capacitance; wherein thermal capacitance ofeach such at least one user selectable thermal capacitance is determinedby holding each such at least one design-goal element within arespective such at least one desired range of variables, incrementallytrial raising each such at least one user selectable thermal capacitancewhile performing such holding step, and essentially maximizing such atleast one user selectable thermal capacitance while remaining withineach respective such at least one desired range of variables; andwherein at least one essentially maximum heat pumped per unit of inputpower is achieved.

In accordance with another preferred embodiment hereof, this inventionprovides a method, relating to protectively transporting equine semen,comprising the steps of: providing at least one transportation vesseladapted to seal such horse semen in isolation from outside environment;providing at least one temperature control system adapted to controltemperature of the horse semen while in such at least one transportationvessel; and providing that such at least one temperature control systemcomprises at least one thermo-electric heat pump; wherein such at leastone thermo-electric heat pump is adapted to controlling temperature ofsuch horse semen to remain in at least one temperature range assistingviability of such horse semen. Moreover, it provides such a methodwherein such at least one thermo-electric heat pump comprises at leastone Peltier thermo-electric device in thermal association with at leastone thermal capacitor having at least one thermal capacitance designedto provide intended to provide intended operational features of such atleast one thermo-electric heat pump.

And it provides for each and every novel feature, element, combination,step and/or method disclosed or suggested by this provisional patentapplication.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 shows a perspective view, illustrating an iso-thermal transportand storage system, according to a preferred embodiment of the presentinvention.

FIG. 2 shows a bottom-side perspective view, illustrating a lid portionof the embodiment of the iso-thermal transport and storage system,according to the preferred embodiment of the present invention in FIG.1.

FIG. 3 shows a partially disassembled perspective view, illustratingarrangement of interior components of the embodiment of iso-thermaltransport and storage system, according to the preferred embodiment ofthe present invention in FIG. 1.

FIG. 4 shows an exploded perspective view, illustrating a matingassembly relationship between a sample rotating assembly and the outerenclosure of the iso-thermal transport and storage system, according tothe preferred embodiment of the present invention in FIG. 1.

FIG. 5 shows a perspective view, illustrating the sample rotatingassembly, according to the preferred embodiment of the present inventionin FIG. 1.

FIG. 6 shows a partially exploded perspective view, illustrating theorder and arrangement of the inner working assembly and sampleplacements of the iso-thermal transport and storage system, according tothe preferred embodiment of the present invention in FIG. 1.

FIG. 7 shows a partially disassembled bottom perspective view,illustrating the inner working assembly of the iso-thermal transport andstorage system, according to the preferred embodiment of the presentinvention in FIG. 1.

FIG. 8 shows a side profile view, illustrating a thermo-electricassembly of the iso-thermal transport and storage system, according tothe preferred embodiment of the present invention in FIG. 1.

FIG. 9A shows an electrical schematic view, illustrating electricalcontrol of the iso-thermal transport and storage system, according tothe preferred embodiment of FIG. 1.

FIG. 9B shows an electrical schematic view, illustrating an alternatelypreferred electrical control of the iso-thermal transport and storagesystem, according to the preferred embodiment of FIG. 1.

FIG. 10 shows a perspective view illustrating the preferred embodiment,of the iso-thermal transport and storage system as viewed fromunderneath, of the present invention of FIG. 11 shows a schematic view,illustrating a control circuit board, according to the preferredembodiment of the present invention in FIG. 1.

FIGS. 12A-B shows perspective views, illustrating a thermoelectrictransport and storage device, according to a preferred embodiment of thepresent invention.

FIGS. 13A-B shows perspective views, illustrating a thermoelectric heatpump assembly with two thermoelectric unit layers, according to apreferred embodiment of the present invention, and a thermoelectrictransport and storage device with a robust shock proof exterior,according to a preferred embodiment of the present invention.

FIG. 14 shows a perspective view, illustrating a portablemicroprocessor, according to a preferred embodiment of the presentinvention.

FIG. 15 shows a side profile view, illustrating a sandwich layer,according to a preferred embodiment of the present invention.

FIG. 16 shows a schematic view of a control hardware block diagram,illustrating momentary relay based circuitry programmable by amicroprocessor adapted to control the temperature of temperaturesensitive goods based on a preferred temperature profile, according to apreferred embodiment of the present invention.

FIG. 17 shows a schematic view of a control logic diagram, illustratinga control illustrating

FIG. 18 shows a schematic view of a control logic diagram of a preferredembodiment of the invention.

FIG. 19 shows an electrical schematic view, illustrating an alternatelypreferred electrical control of a thermoelectric heat pump assembly,according to the preferred embodiment of the invention.

FIG. 20 shows an electrical schematic view, illustrating an alternatelypreferred electrical control of a thermoelectric heat pump assembly,according to the preferred embodiment of the invention.

FIG. 21 shows an electrical schematic view, illustrating an alternatelypreferred electrical control of a thermoelectric heat pump assembly,according to the preferred embodiment of the invention.

FIG. 22 shows an electrical schematic view, illustrating an alternatelypreferred electrical control of a thermoelectric heat pump assembly,according to the preferred embodiment of the invention.

FIG. 23 shows two charts, each of which illustrate how preferredembodiments of the present invention are configured to maximizeefficiency of operation compared to previously available thermoelectricheat pump systems; the charts further illustrate how the preferredembodiments of the present invention are configured to maximize heatpumped per unit of input power during overall use.

FIGS. 24A-B show an electrical schematic view, illustrating a preferredembodiment of the present invention, wherein the thermoelectric heatpump assembly contains six thermoelectric unit layers, and wherein thethermoelectric unit layers are reconfigurable between a higher powersetting and a lower power setting, and series and/or parallelconfigurations.

FIGS. 25A-B show electrical schematic views, illustrating a preferredembodiment of the present invention, wherein the thermoelectric heatpump assembly contains nine thermoelectric unit layers, and wherein thethermoelectric unit layers are reconfigurable between a higher powersetting and a lower power setting, and series and/or parallelconfigurations.

FIG. 26A shows an electrical schematic view, illustrating a preferredembodiment of the present invention, wherein the thermoelectric heatpump assembly contains nine thermoelectric unit layers, and wherein thethermoelectric unit layers are reconfigurable between a higher powersetting and a lower power setting, and series and/or parallelconfigurations; and FIG. 26B shows an electrical schematic view,illustrating a preferred embodiment of the present invention, whereinthe thermoelectric transport and storage device contains at least twothermoelectric heat pump assemblies.

FIGS. 27A-B show an electrical schematic view, illustrating a preferredembodiment of the present invention, wherein the thermoelectric heatpump assembly contains two thermoelectric unit layers, and wherein thethermoelectric unit layers are reconfigurable between a higher powersetting and a lower power setting, and series and/or parallelconfigurations.

FIGS. 28A-B show charts, each of which illustrate how preferredembodiments of the present invention are configured to maximizeefficiency of operation compared to previously available thermoelectricheat pump systems; the charts further illustrate how the preferredembodiments of the present invention are configured to maximize heatpumped per unit of input power during overall use, while minimizing theratio of input current to maximum available current at a givensteady-state temperature.

FIGS. 29A-C show charts, illustrating how preferred embodiments of thepresent invention are configured to maximize efficiency of operationcompared to typical thermoelectric heat pump systems; the charts furtherillustrate how the preferred embodiments of the present invention areconfigured to maximize heat pumped per unit of input power duringoverall use, while minimizing the ratio of input current to maximumavailable current at a given steady-state temperature.

FIGS. 30A-C show charts, illustrating how preferred embodiments of thepresent invention are configured to maximize efficiency of operationcompared to typical thermoelectric heat pump systems; the charts furtherillustrate how the preferred embodiments of the present invention areconfigured to maximize heat pumped per unit of input power duringoverall use, while minimizing the ratio of input current to maximumavailable current at a given steady-state temperature.

DETAILED DESCRIPTION OF THE BEST MODES AND PREFERRED EMBODIMENTS OF THEINVENTION

Steady-state, as used herein, is the state at which, during operationthe heat pump assembly, the heat pump assembly reaches a selectedtemperature. For example, the heat pump assembly reaches a settemperature and the system is substantially balanced and is simplymaintaining the set temperature.

Ambient Temperature is the temperature of the air or environmentsurrounding a thermoelectric cooling system; sometimes called roomtemperature.

COP (Coefficient of Performance) is the ratio of the heat removed oradded, in the case of heating, divided by the input power.

DTmax is the maximum obtainable temperature difference between the coldand hot side of the thermoelectric elements within the module when Imaxis applied and there is no heat load applied to the module.

Heat pumping is the amount of heat (Q) that a thermoelectric device iscapable of removing, or “pumping”, at a given set of operatingparameters. For example, at a steady-state, when change in temperature(ΔT) of the heat pump assembly at the top end compared to the bottom endof the heat pump assembly is 20° C. and heat (Q) is 0.5 Watts, oralternatively when change in temperature (ΔT) of the heat pump assemblyat the top end compared to the bottom end of the heat pump assembly is40° C. and heat (Q) is 1.

Heat sink (also a cold sink when run in reverse) is a device that isattached to the hot side of thermoelectric module. It is used tofacilitate the transfer of heat from the hot side of the module to theambient.

Imax is the current that produces DTmax when the hot-side of theelements within the thermoelectric module are held at 300 K.

Peltier Effect is the phenomenon whereby the passage of an electricalcurrent through a junction consisting of two dissimilar metals resultsin a cooling effect. When the direction of current flow is reversedheating will occur.

Qmax is the amount of heat that a TE cooler can remove when there is azero degree temperature difference across the elements within a moduleand the hot-side temperature of the elements are at 300 K.

Thermal conductivity relates the amount of heat (Q) an object willtransmit through its volume when a temperature difference is imposedacross that volume.

Vmax is the voltage that is produced at DTmax when Imax is applied andthe hot-side temperature of the elements within the thermoelectricmodule are at 300 K.

FIG. 1 shows a perspective view, illustrating at least one embodiment102 of iso-thermal transport and storage system 100, according to apreferred embodiment of the present invention. Iso-thermal transport andstorage system 100 is preferably designed to protect sensitive andperishable sensitive goods 139 (see FIG. 4, FIG. 5 and FIG. 6),preferably mammal biological matter, preferably mammal reproductivecells and/or tissues, preferably horse semen (at least embodying hereina thermal protection system, relating to thermally protectingtemperature-sensitive goods). Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other sensitive andperishable sensitive goods, such as cell and tissue cultures, nucleicacids, semen, stem-cells, ovaries, equine reproductive matter, bodilyfluids, tissues, organs, and/or embryos plant tissues, blood, platelets,fruits, vegetables, seeds, live insects and other live samples,barely-frozen foods, pharmaceuticals, vaccines, chemicals, sensitivegoods yet to be developed, etc., may suffice.

Outer enclosure 105 preferably comprises a rectangular-box construction,as shown. Outer enclosure 105 preferably includes lid portion 150,enclosure portion 180, and base portion 190, as shown. Externaldimensions of outer enclosure 105 preferably are about 14 inches inlength with a cross-section of about 9-inches square, as shown.

Lid portion 150 preferably attaches to enclosure portion 180, preferablywith at least one thumbscrew 151 and preferably at least one fibrouswasher 152, as shown and explained herein. When lid portion 150 attachesto enclosure portion 180, such attachment preferably provides anairtight seal, as shown, preferably preventing contamination ofenclosure portion 180 from external contaminants. Leakages of externalcontaminants, including microorganisms, into enclosure portion 180 arepreferably prevented by applying pressure between at least one raisedinner-portion 158, of lid portion 150, and threaded cap 142, as shown(also see FIG. 2 and FIG. 3) (at least herein embodying wherein said atleast one vessel comprises at least one re-sealable surface structuredand arranged to ingress and egress the temperature sensitive goods toand from said at least one thermal isolator) (at least herein embodyingwherein said at least one re-sealable surface comprises at least oneseal structured and arranged to exclude at least one microorganism fromsaid at least one vessel). Upper-lid raised inner-portion 158 of lidportion 150 preferably is shaped, as shown, preferably by millingalternately preferably molding. Upper-lid raised inner-portion 158preferably seals to the top of threaded cap 142 (see FIG. 2 and FIG. 3).

Fibrous washer 152 preferably comprises an outside diameter of about ½inch, an inner diameter of about ¼ inch, and a thickness of about 0.08inch. Over-tightening of thumbscrew 151 may cause cracking or distortionof lid portion 150 or degradation of fibrous washer 152. Fibrous washer152 preferably protects at least one lid portion 150 from at least oneuser 200 damaging lid portion 150, due to over-tightening of thumbscrew151. Fibrous washer 152 preferably withstands high compression loads,preferably up to 2000 pounds per square inch (psi) and preferablyprevents vibration between mating surfaces of lid portion 150 andenclosure portion 180. Also, each fibrous washer 152 preferably providessufficient friction to prevent loosening of each respective thumbscrew151, as shown. Further, fibrous washer 152 preferably comprises a flat,deformable, inexpensive-to-produce, readily available, vulcanized,fibrous material, preferably adhering to ANSI/ASME B18.22.1 (1965R1998). Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other washer materials, such as gasket paper,rubber, silicone, metal, cork, felt, Neoprene, fiberglass, a plasticpolymer (such as polychlorotrifluoroethylene), etc., may suffice.

Thumbscrew 151 preferably features at least one plastic grip 163,preferably with at least one tang 164, as shown. User 200 preferablygrasps plastic grip 163 to tighten or loosen thumbscrew 151, preferablyusing at least three fingers. User 200 preferably uses tang 164 to applyrotary pressure to plastic grip 163 for tightening or loosening ofthumbscrew 151, as shown. Upon reading this specification, those skilledin the art will now appreciate that, under appropriate circumstances,considering such issues as future technology, cost, applicationrequirements, etc., other grips, such as, for example, interlockingheads, wings, friction, etc., may suffice.

Thumbscrew 151 preferably comprises at least one 300-seriesstainless-steel stud with preferably about ¼-20 inch threads, preferablymounted in phenolic thermosetting resin (preferably reinforced laminateproduced from a medium weave cotton cloth impregnated with a phenolicresin binder, preferably MIL-i-24768/14 FBG). Plastic grip 163preferably has about a 1½ inch wide top, preferably is about ⅝ inchthick, and preferably has about a ¼-inch offset between top portion ofscrew thread 148 and plastic grip 163. Screw thread 148 preferably isabout ¾ inch long. Thumbscrew 151 preferably comprises part number57715K55 marketed by McMaster-Carr. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other thermosettingcomposites, such as polyester, epoxy, vinyl ester matrices withreinforcement fibers of glass, carbon, aramid, etc., may suffice.

Stainless steel possesses wear resistance properties appropriate towithstand rough treatment during commercial transport and storage.Stainless steel also provides corrosion proofing to ensure longevity ofthumbscrew 151 for applications when embodiment 102 of iso-thermaltransport and storage system 100 experiences moisture or corrosiveenvironments. Upon reading this specification, those skilled in the artwill now appreciate that, under appropriate circumstances, consideringsuch issues as future technology, cost, application requirements, etc.,other screw materials, such as, for example, plastics, other metals,cermets, etc., may suffice.

Upon reading the teachings of this specification, those with ordinaryskill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other fastening means, such as adhesives, fusionprocesses, other mechanical fastening devices including screws, nails,bolt, buckle, button, catch, clasp, fastening, latch, lock, rivet,screw, snap, and other fastening means yet to be developed, etc., maysuffice.

At least one raised section 165 of lid portion 150 preferablysubstantially surrounds thumbscrew 151, as a protective guard, toprotect thumbscrew 151 from damage or accidental adjustment, as shown.Raised section 165 preferably is about 1¼ inch tall, about 3¼ incheswide, and about 3¼ inches long, and preferably is located at each of thefour corners of lid portion 150, as shown. Upon reading the teachings ofthis specification, those with ordinary skill in the art will nowappreciate that, under appropriate circumstances, considering issuessuch as changes in technology, user requirements, etc., other protectiveguards, such as, for example, protective rims, gratings, handles,blocks, buffers, bulwarks, pads, protections, ramparts, screens,shields, wards and other such protective guards yet to be developed,etc., may suffice.

Enclosure portion 180 preferably contains a means to accept at least onescrew thread 148 on thumbscrew 151, preferably threaded insert 182, asshown in FIG. 3 and FIG. 4. Internal thread size of threaded insert 182is preferably about ¼-20 with a barrel diameter of about ⅓ inch, and aflange thickness of about 1/12 inch. Length of threaded insert 182preferably is about 9/16 inch. Threaded insert 182 preferably is moldedinto, or, alternately preferably, swaged into, enclosure portion 180, asshown in FIG. 3 and FIG. 4. Threaded insert 182 is preferably made ofdie-cast zinc to provide rust and weather resistance. Threaded insert182, as used in embodiment 102, preferably comprises part number91316A200 sold by McMaster-Carr. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other threaded inserts,such as self-tapping, ultrasonic inserts for use on plastic, metal, orwood-base materials yet to be developed, etc., may suffice.

Inner-layer 155, located within lid portion 150, preferably is formedfrom urethane, as shown. Inner-layer 155 preferably is about 1¼ inchesthick. Inner-layer 155 preferably is formed from expanded-urethanesemi-rigid foam having a density of about of 2 pounds per cubic foot(lb/cu. ft.). Inner-layer 155 preferably utilizes part number SWD-890 asproduced by SWD Urethane Company. Urethane is a thermoplastic elastomerthat combines positive properties of plastic and rubber. Urethane-foamcells preferably are created by bubbling action of gases that createsmall air-filled pockets (preferably no more than 1/10 inch in diameter)that are preferable for creating both resistance to thermal transfer andstructural integrity. Further, the urethane foam preferably acts as animpact absorber to protect components of iso-thermal transport andstorage system 100 and sensitive and perishable sensitive goods 139 frommechanical shock and vibration during storage and transport, as shown.Upon reading the teachings of this specification, those with ordinaryskill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other forming means, such as other urethane foamingtechniques/materials, plastic or other material, for example, polyvinylchloride, polyethylene, polymethyl methacrylate, and other acrylics,silicones, polyurethanes, or materials such as composites, metals oralloys yet to be developed, etc., may suffice.

Inner-layer 155 of lid portion 150 preferably is encapsulated inouter-surfacing layer 156 that preferably comprises a toughsemi-rigid-urethane plastic, as shown. Outer-surfacing layer 156preferably provides durability and protection for embodiment 102 ofiso-thermal transport and storage system 100 during rough handling andincidents of mechanical shock and vibration. Outer-surfacing layer 156preferably is tough but preferably amply flexible to withstand directimpact loads associated with normal commercial storage andtransportation, as defined by ASTM D3951-98 (2004) Standard Practice forCommercial Packaging. Outer-surfacing layer 156 preferably is about ⅛inch thick, as shown, and is preferably about 7 lb/cu. ft. density.Outer-surfacing layer 156 preferably utilizes part number SWD-890 asproduced by SWD Urethane Company.

Vacuum insulated panels (VIPs) preferably are incorporated within lidportion 150 as VIP vacuum-panel 157 and in VIP insulation 108, as shown(also see FIG. 7) (at least embodying herein at least one thermalisolator for thermally isolating the temperature sensitive goods) (atleast herein embodying wherein said at least one thermal isolatorcomprises at least one vacuum insulator for vacuum-insulating thetemperature sensitive goods). VIPs preferably use the thermal insulatingeffects of a vacuum to produce highly efficient thermal insulationthermal insulation values (R-values) as compared to conventional thermalinsulation, as shown. VIP vacuum-panel 157 and VIP insulation 108preferably comprise NanoPore HP-150 core as made by NanoPore,Incorporated. NanoPore HP-150 core, which comprises a preferred thermalinsulation for embodiment 102 of iso-thermal transport and storagesystem 100, has an R-value of about R-30 per inch and operates over atemperature range from about −200 degrees centigrade (° C.) to about125° C. VIP vacuum-panel 157 and VIP insulation 108 preferably compriselayers of reflective film, having less than about 0.1, in the infraredspectrum from about one micron to about one millimeter wavelength,separating evacuated volumes, having pressure levels of less then 10Torr. (at least herein embodying wherein said at least one vacuuminsulator comprises at least one layer of reflective material; and atleast herein embodying wherein infrared emittance of said reflectivematerial is less than about 0.1, in the infrared spectrum from about onemicron to about one millimeter wavelength; and at least herein embodyingwherein absolute pressure of said least one evacuated volume is lessthan about 10 Torr).

VIP vacuum-panel 157, as used in the present invention, preferably isencased in urethane foam to protect VIP vacuum-panel 157 from mechanicaldamage during usage of embodiment 102 of iso-thermal transport andstorage system 100, as shown. The thermal insulation of VIP vacuum-panel157 becomes more effective when lid-horizontal decking-surface 153 (seeFIG. 2) is in full contact with enclosure upper-horizontaldecking-surface 181 (see FIG. 3), as shown.

Lid portion 150 also preferably provides at least one substantiallyflat-surface 159 that serves as a location for preferably displaying atleast one indicia 160, as shown. User 200 preferably may place indicia160 on at least one flat-surface 159, as shown. Indicia 160 preferablymay aid in designating ownership, advertising, or warnings forembodiment 102 of iso-thermal transport and storage system 100 and/orthe contents contained in embodiment 102 of iso-thermal transport andstorage system 100, as shown.

At least one rivet 162 preferably is used when enclosure portion 180 isformed from at least one wall section 201 and at least one cornersection 202, which require a fastening means to join the sectionstogether, as shown. Wall section 201 preferably is about ⅛ inch thick,preferably made from aluminum alloy 6061, preferably T6 tempering,preferably anodized coated. Corner section 202 preferably is about ⅛inch thick, preferably made from aluminum alloy 6061, preferably T6tempering, preferably anodize coated. At least one rivet 162 preferablyis used to hold at least one wall section 201 attach to at least onecorner section 202. Rivet 162 preferably is selected to withstandtension loads parallel to the longitudinal axis of rivet 162 and sheerloads perpendicular to the longitudinal axis of rivet 162.

Rivet 162 preferably comprises a blind rivet, alternately preferably asolid rivet. Rivet 162 preferably is made from aluminum alloy 2024, asshown. Rivet 162 preferably has a head of about ⅓ inch diameter andpreferably has a shaft of about 5/32 inch diameter. Rivet 162 preferablycomprises part number 97525A470 from McMaster-Carr. Hole size (in wallsection 201 and corner section 202) for rivet 162 preferably may rangefrom about 0.16 inch to about 0.17 inch in diameter. The shaft of rivet162 preferably is about ½ inch diameter and preferably is upset to forma buck-tail head about ⅓ inch diameter after being inserted throughholes, in wall section 201 and corner section 202, located near at leastone corner of outer enclosure 105, as shown herein. Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., othersecuring means, such as bolts, buckles, buttons, catches, clasps,fastenings, latches, locks, rivets, screws, snaps, adapters, bonds,clamps, connections, connectors, couplings, joints, junctions, links,ties yet to be developed, etc., may suffice.

User 200 may impart rough treatment to embodiment 102; thus, the designpreferably employs plastic material capable of absorbing impact forces.The nature of the construction of embodiment 102, in combination withexpandable urethane 115 as insulation, assists isolation ofthermo-electric assembly 123, as shown in FIG. 3, which is prone todamage from mechanical shock and/or vibration, from mechanical shock.Upon reading the teachings of this specification, those with ordinaryskill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other impact absorption materials, for example,polyvinyl chloride, polyethylene, polymethyl methacrylate, and otheracrylics, silicones, polyurethanes, composites, rubbers, soft metals orother such materials yet to be developed, etc., may suffice.

Enclosure portion 180 comprises at least one vent 183, preferablylocated on at least one vertical surface 161, preferably in closeproximity to base portion 190, as shown. Vent 183 preferably allowsambient air to freely enter and circulate throughout at least oneinterior portion of outer enclosure 105, preferably using at least onefan 120, as shown (also see FIG. 7). Vent 183 preferably provides abouta 25% free flow opening (of the lower portion of wall section 201),through which air preferably may be drawn in or exhausted, as shown.Vent 183 preferably comprises about 80 slots 184, each about ⅓ inch wideand about 1 inch high, as shown. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other opening means,such as holes, apertures, perforations, slits, or windows yet to bedeveloped but which are capable of ambient air ingress and egress, etc.,may suffice.

Base portion 190 preferably may use at least one rivet 162 preferably toconnect to enclosure portion 180, thereby providing structural integrityfor embodiment 102, as shown (also see FIG. 3). Upon reading theteachings of this specification, those with ordinary skill in the artwill now understand that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., otherfastening devices, such as bolts, buckles, clasps, latches, locks,screws, snaps, clamps, connectors, couplings, ties or other fasteningmeans yet to be developed, or fusion welding, adhesives, etc., maysuffice.

Base portion 190 further preferably provides a mounting surface for atleast one battery system 119 and preferably a means for enclosingenclosure portion 180 from the bottom, as shown (also see FIG. 3). Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other enclosing means, such as lids, caps, covers, hoods, floors,bottoms or other such enclosing device yet to be developed, etc., maysuffice.

FIG. 2 shows a bottom-side perspective view, illustrating lid portion150 of embodiment 102 of iso-thermal transport and storage system 100,according to the preferred embodiment of FIG. 1. Lid-horizontaldecking-surface 153 preferably is molded, alternately preferablymachined, to be a mating and sealing surface with enclosureupper-horizontal decking-surface 181, as shown (also see FIG. 3).Lid-horizontal decking-surface 153 and enclosure upper-horizontaldecking-surface 181 preferably come into complete contact with eachother, as shown in FIG. 1, preferably forming one of two barriersbetween the external environment and the contents of vessel 121, asshown (at least embodying herein wherein said at least one thermalisolator comprises at least one vessel structured and arranged tocontain the temperature sensitive goods). Upon reading the teachings ofthis specification, those with ordinary skill in the art will nowunderstand that, under appropriate circumstances, considering issuessuch as changes in technology, user requirements, etc., other enclosuremeans, such as lids, caps, covers, hoods, or floors, yet to bedeveloped, etc., may suffice.

VIP vacuum-panel 157 preferably is embedded in lid portion 150 andpreferably provides thermal insulation within embodiment 102, as shown.VIP vacuum-panel 157 preferably is about 4 inches wide, about 4 incheslong and about 1 inch thick, as shown. Upon reading this specification,those skilled in the art will now appreciate that, under appropriatecircumstances, considering such issues as future technologies,application requirements, etc., other VIP vacuum panel sizes, maysuffice.

At least one retainer 149 preferably holds thumbscrew 151 and fibrouswasher 152 from becoming detached from lid portion 150, as shown.Retainer 149 preferably slides smoothly down the threads when installed,such that thumbscrew 151 and fibrous washer 152 preferably are retainedwithin at least one lid alignment well 166 in lid portion 150, as shown.Retainer 149 preferably is about 5/16 inch inner diameter, about ⅝ inchouter diameter, and is preferably made of black phosphate spring steel,as shown. Retainer 149 preferably comprises part number 94800A730 fromMcMaster-Carr. Upon reading the teachings of this specification, thosewith ordinary skill in the art will now appreciate that, underappropriate circumstances, considering issues such as changes intechnology, user requirements, etc., other retaining means, such asclasps, clamps, holders, ties and other retaining means yet to bedeveloped, etc., may suffice.

Lid alignment well 166 preferably aligns with at least one lid alignmentpost 167 (see FIG. 3). Lid alignment well 166 and lid alignment post 167preferably allow quick alignment of lid portion 150 to enclosure portion180.

FIG. 3 shows a partially disassembled perspective view, illustratingarrangement of inner-workings assembly 106 of embodiment 102 ofiso-thermal transport and storage system 100, according to the preferredembodiment of the present invention in FIG. 1. FIG. 3 also showsthreaded cap 142, which preferably is about 7½ inches in diameter andabout ¾ inch thick. Threaded cap 142 preferably assists isolation ofsensitive and perishable sensitive goods 139 from its surroundings, asshown. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other methods of isolation, such as caps, coverings,packings, gaskets, stoppers yet to be developed, etc., may suffice.

FIG. 3 also shows at least one battery system 119, preferably mounted onbase portion 190. Battery system 119 preferably provides a portable,reliable power source for long durations while sensitive and perishablesensitive goods 139 are being transported in embodiment 102. At leastone circuit board 117 preferably is wired to, and powered by, batterysystem 119 using at least one wire 177, as shown. Battery system 119 ofthe present invention preferably is about 3.6 volt DC supply. Batterysystem 119 preferably is rechargeable, preferably provides a source ofpower for thermo-electric assembly 123, and preferably is controlled byat least one safety on/off switch 118, as shown. Where an external powersource is available, battery system 119 preferably may be rechargedwhile embodiment 102 is in storage or transport.

In addition, at least one sample battery pack 143 preferably may bemounted on sample assembly frame 141, as shown in FIGS. 4 and 5. Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other power sources, such as accumulators, dry batteries,secondary batteries, secondary cells, storage cells, storage devices,wet batteries or other such storage means yet to be developed, or afixed power source, etc., may suffice.

Wire 177 as shown comprises about 16 AWG coated 26/30 gage copperstranded-conductors with an insulation thickness of about 1/64 inchesand a diameter of about 1/12 inches, as shown. Operating temperaturerange of wire 177 preferably is from about −40° C. to about 105° C.Insulation covering conductors of wire 177 preferably is color-codedpolyvinyl chloride (PVC). Voltage rating of wire 177 is about 300V. Wire177 preferably is marketed by Alpha Wire Company part number 3057. Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other wiring configurations for example parallel, otherseries/parallel connections, other size wire, etc., may suffice.

FIG. 3 also shows thermo-electric assembly 123, preferably comprising atleast one thermo-electric semi-conductor node 133 (see FIG. 8)preferably capable of being wired in at least one series and/or parallelconfiguration to at least one battery system 119. Thermo-electricsemi-conductor node 133 preferably provides an incremental temperaturestaging means (at least embodying herein at least one thermo-electricheat pump adapted to control-at least one temperature of thetemperature-sensitive goods; wherein said at least one thermo-electricheat pump comprises at least one thermo-electric device adapted toactive use of the Peltier effect). Thermo-electric assembly 123preferably is about 7⅝ inches high, about 5 inches long and about 5inches wide when stacked, as shown. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other heat-transferringeffects, such as induction, thermal radiation means yet to be developed,etc., may suffice.

In embodiment 102, user 200 may select at least one set-pointtemperature for sensitive and perishable sensitive goods 139. Embodiment102 preferably then automatically maintains the at least one set-pointtemperature for sensitive and perishable sensitive goods 139, preferablyfor a duration necessary to store or transport sensitive and perishablesensitive goods 139 to at least one predetermined destination.Embodiment 102 preferably uses thermo-electric assembly 123, preferablyin conjunction with fan 120, preferably in at least one closed-loopfeedback sensing of at least one thermocouple 124, as shown.Thermocouple 124 preferably comprises at least one temperature-sensingchip, such as produced by Dallas Semiconductor part number DS18B20.Thermocouple 124 preferably is used as a single-wire programmabledigital-thermometer to measure temperatures at thermocouple 124, asshown. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other temperature tuning means, such as adjusters,dials, knobs, on/off power switches, switches, toggles, tuners,thermo-conductive means or other temperature tuning means yet to bedeveloped, etc., may suffice.

Embodiment 102 preferably comprises at least one vessel 121 preferablydesigned to store and contain sensitive and perishable sensitive goods139, as shown. Vessel 121 preferably is made from urethane or,alternately preferably, aluminum. Upper section of vessel 121 preferablycomprises at least one inner threaded portion 189 that permits vessellid 122, having an external threaded portion 185, to be threadedtogether (also see FIG. 4). Threading together of upper section ofvessel 121 and vessel lid 122, as shown in FIG. 6, preferably provides aseal that isolates sensitive and perishable sensitive goods 139 from thelocal environment. Vessel lid 122 alternately preferably may have afriction fit sealing relationship with vessel 121, as shown. Tolerancesfor friction fit will depend on pressure required to be maintainedwithin vessel 121. Upon reading the teachings of this specification,those with ordinary skill in the art will now appreciate that, underappropriate circumstances, considering issues such as changes intechnology, user requirements, etc., other means of attaching, such as,clamped-lid mechanisms, bolted lids, joined by adhesives and other meansyet to be developed, etc., may suffice.

Aluminum 6069-T4 may preferably be used, due to its light weight andability to withstand high pressure, should sensitive and perishablesensitive goods 139 need to be maintained at a high pressure. Aluminumpreferably is used because of its high thermal conductivity of about, atabout 300° Kelvin (300° K), 237 watts-per meter-degree Kelvin(W·m⁻¹·K⁻¹), manufacturability, light weight, resistance to corrosion,and relative dimensional stability (low thermal expansion rate) over asubstantial working temperature range. During the heat transferprocesses, materials store energy in the intermolecular bonds betweenthe atoms. [When the stored energy increases (rising temperatures of thematerial), so does the length of the molecular bond. This causes thematerial to expand in response to being heated, and causes contractionwhen cooled.] Embodiment 102 preferably overcomes this problem by usingaluminum due to the relatively low thermal expansion rate of about 23.1micro-meters per meter per degree Kelvin (μm·m⁻·K⁻¹)(300° K.). Thisproperty preferably allows embodiment 102 to effectively managethermally induced linear, area, and volumetric expansions throughout awide range of ambient temperatures and desired set-point temperaturesfor sensitive and perishable sensitive goods 139. Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., othermaterials, such as, for example, copper, copper alloys, other aluminumalloys, low-thermal-expansion-composite constructions, etc., maysuffice.

At least one volume 116 exists between VIP vacuum-panel 157 and vessel121 mounted above thermo-electric assembly 123, as shown. Volume 116preferably is filled with expandable urethane 115, as shown. Preferably,the expandable urethane 115 foam has a density of about 2 lb/cu. ft.Expandable urethane 115 preferably secures all components within theupper portion of embodiment 102, as shown. Expandable urethane 115 foampreferably is only allowed to fill the portion shown within theillustration so as to preferably allow ample available space for heatsink 114, at least one fan assembly 127, and at least one battery system119 to operate in a non-restricted manner, as shown (also see FIG. 6).

Alternately preferably, volume 116 between VIP vacuum-panel 157 andvessel 121 preferably is filled up to three layers of about ½ inch thickVIPs. Such VIPs preferably are curved around vessel 121 andthermo-electric assembly 123, preferably creating a total minimumthickness of about 1½ inches, as shown. Square-box style VIPs may alsobe used depending on specific geometries associated with embodiment 102.After such VIPs are positioned around vessel 121 and thermo-electricassembly 123, preferably the remaining cavity areas are filled withexpandable urethane 115. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now understandthat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other surface coolingmeans, such as appendages, projections, extensions, fluidheat-extraction means and others yet to be developed, etc., may suffice.

All of the mentioned items within inner-workings assembly 106 loseefficiency if not cooled. Fan 120 preferably circulates ambient airthrough vent 183, preferably impinging on at least one fin 113, asshown. Fin 113 preferably absorbs heat from the air (in heating mode) orpreferably rejects heat to the air (cooling mode). Fin 113 furtherpreferably transports heat from/to its surface into heat sink 114,preferably through conductive means. Fin 113 and heat sink 114preferably are comprised of 3000 series aluminum. Aluminum alloys havethe significant advantage that they are easily and cost-effectivelyformed by extrusion processes. Upon reading this specification, thoseskilled in the art will now appreciate that, under appropriatecircumstances, considering such issues as future technologies, cost,available materials, etc., other fin and heat sink materials, such as,for example, other aluminum alloys, copper, copper alloys, ceramics,cermets, etc., may suffice. Heat sink 114 preferably is designed forpassive, non-forced air-cooling, as shown.

Fan 120 preferably provides necessary thermal control by creating anactive means of air movement onto heat sink 114 surfaces, as shown. Fanassembly 127 preferably is about 3⅞ inches long, about 3⅞-inches wideand about 1⅓ inches high. Fan 120 preferably comprises model numberGM0504PEV1-8 part number GN produced by Sunon. Fan 120, is preferablyrated at about 12 VDC, however, fan 120 preferably operates at 5VDC.Airflow preferably is about 5.9 cubic feet per minute (CFM) at a speedof about 6000 revolutions per minute (rpm) with a power consumption ofabout ⅜ watts (W). Noise of fan 120 preferably is limited to about 26decibels (dB). Fan 120 preferably weighs about 7.5 grams (g).

Fan 120 alternately preferably is operated at about 5 volts with a DC/DCboost converter, not shown. The DC/DC boost converter preferably is astep-up type, preferably with a start-up of less than 0.9 VDC with about1 mill-ampere (mA) load. The DC/DC boost converter preferably comprisespart number AP1603 as marketed by Diodes Incorporated. Upon reading theteachings of this specification, those with ordinary skill in the artwill now understand that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., otherconversion means, such as, for example, buck converter or buck-boostconverter yet to be developed, etc., may suffice.

Heat sink 114 preferably comprises at least one heat-sink plate 136,base surface 171 (at least embodying herein wherein said at least onevessel comprises at least one heat-transferring surface structured andarranged to conductively exchange heat to and from said at least onetemperature controller), and fins 113. Heat sink 114 preferably isFH-type as produced by Alpha Novatech, Inc., as shown. A preferredconfiguration of heat sink 114 comprises about 200 individual, fins 113,preferably shaped hexagonally, preferably with dimensions of about ⅛inch wide across the flats and about 1⅓ inches long, as shown. Fins 113are preferably arranged in a staggered relationship on heat-sink plate136, as shown. Heat-sink plate 136 preferably is about ¼ inch thick,about 3⅞ inches wide and about 3⅞ inches long, as shown. Heat-sink plate136 and fins 113 preferably comprise a one-piece extrusion. Base surface171 of heat sink 114 preferably is flat and smooth to ensure adequatethermal contact with the object being cooled or heated, as shown. Uponreading the teachings of this specification, those with ordinary skillin the art will now understand that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other heat sink materials, such as copper, gold, silver, brass,tungsten, ceramics, cermets, or metal alloys of different sizes andconfigurations, etc., may suffice.

FIG. 4 shows an exploded perspective view, illustrating a matingassembly relationship between at least one sample rotating assembly 109and outer enclosure 105 of the iso-thermal transport and storage system100, according to the preferred embodiment of the present invention inFIG. 1.

Vessel 121 preferably may be designed to allow rotation capability, asshown. Further, vessel 121 alternately preferably may be designed toallow at least one formed separator support sample tube 140, set invessel 121, and preferably spaced so as to eliminate contact with anyother sample tube 140, as shown in FIG. 6. Sample tube 140 preferablymay be made of glass, alternately preferably metal alloy, alternatelypreferably plastic, alternately preferably composite material.

Sample rotating assembly 109 preferably comprises a removable assemblythat preferably allows rotation of at least one sample tube 140 whilesample assembly frame 141 preferably remains stationary within theconfines of outer enclosure 105, as shown. Sample rotating assembly 109preferably is located within outer enclosure 105, as shown. Samplerotating assembly 109 preferably is held securely by means of threadedcap 142 that preferably restricts any upward motion of sample rotatingassembly 109 within outer enclosure 105, as shown. Sample rotatingassembly 109 preferably is about 11 inches in diameter and about 3 7/16inches wide, as shown. User 200 may preferably open, close, and reopenlid portion 150 during storage, or during transport, preferably withoutcompromising the integrity of sensitive and perishable sensitive goods139.

Maintaining integrity of sensitive and perishable sensitive goods 139comprises protection from, for example, contamination by foreign gases,liquids, moisture, or solids, preferably minimizing any fluctuations intemperature, preferably preventing any spillage or degradation byultraviolet or other forms of radiation, as shown. If integrity is notmaintained, sensitive and perishable sensitive goods 139 may die,degrade through separation, denature, deform, mold, dry out, becomecontaminated, or be unusable or inaccurate, i.e., if not kept within aprotective isolated environment. Sensitive and perishable sensitivegoods 139 preferably maintain integrity due to the further sealingwithin vessel 121, as shown. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other enclosing meansfor example caps, covers, hoods, roofs, top and others yet to bedeveloped, or other rotational means, etc., may suffice.

As shown in FIG. 4, sample assembly frame 141 provides a structuralmount for mounting at least one sample battery pack 143, as shown. Also,sample assembly frame 141 preferably provides a suspending mount,preferably flat-bar 173, to suspend at least one rotating cylinder 145,as shown. Additionally, sample assembly frame 141 preferably provides ahandle for user 200 to grasp sample rotating assembly 109 preferably forlifting-from or lowering-into outer enclosure 105, as shown.

User 200 preferably may remove sample rotating assembly 109 for accuracyof filling or dispensing from sensitive and perishable sensitive goods139 into at least one sample tube 140, as also shown in FIG. 5. Thisfeature preferably also permits ease of cleaning and sanitizing ofembodiment 102 by user 200 at re-use intervals of embodiment 102, asshown (at least embodying herein wherein such step of providing re-usecomprises at least one cleaning step). Sample rotating assembly 109preferably requires less space when removed from outer enclosure 105, asshown, for instances when space is limited such as in laboratorysettings. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other portable containing means, such as bags,canisters, chambers, flasks, humidors, receptacles, or vessels yet to bedeveloped, etc., may suffice.

FIG. 5 shows a perspective view, illustrating sample-rotating assembly109, according to the preferred embodiment of the present invention inFIG. 1. Sample battery pack 143 preferably comprises at least onebattery 186, preferably three AAA-sized batteries (each preferablyhaving about 7/16-inch outer diameter and being about 1¾ inches long) asshown. These batteries preferably may be tabbed for ease ofinterconnection and removal, as shown. These batteries preferably areseries connected to supply about 3.6 volts direct current (VDC) tosupply power to sample rotating assembly 109, as shown. Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., otherbatteries, such as, for example, AA-sized batteries, unified batterypacks, etc., may suffice.

Batteries 186 preferably comprise alkaline batteries, alternatelypreferably, high capacity nickel metal hydride (NiMH) batteries,alternately preferably lithium ion batteries, alternately preferablylithium polymer batteries. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other battery materials,such as, for example, other metal hydrides, electrolytic gels,bio-electric cells, etc., may suffice.

Sample battery pack 143 preferably provides power for at least one gearmotor 144 preferably to turn at least one shaft 146, as shown (at leastherein embodying wherein said at least one goods rotator is structuredand arranged to self-power from at least one energy storage device) (atleast herein embodying wherein said least one energy storage devicecomprises at least one battery). Shaft 146 preferably is connected toone end of rotating cylinder 145 and preferably connected to at leastone gear motor 144 on the opposing end of rotating cylinder 145, asshown. When at least one gear motor 144 is activated, shaft 146preferably rotates rotating cylinder 145 preferably turning about thelongitudinal axis of shaft 146, as shown. The rotating motion preferablymay be enabled to one direction, or, alternately preferably, in twodirections for agitating, depending on application requirements topreserve sensitive and perishable sensitive goods 139. Shaft 146preferably has an outer diameter of about ½ inch and is about 3¼ incheslong, as shown. Gear motor 144 preferably has about 1-inch outerdiameter and about ½ inch length, as shown (at least herein embodyingwherein said at least one thermal isolator comprises at least one goodsrotator structured and arranged to rotate the temperature sensitivegoods within said at least one thermal isolator). Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., otherrotating means, such as worm and pinion combinations, gearingcombinations, sprockets and chains, pulleys and belts or chains andswing mechanical mechanisms yet to be developed, etc., may suffice.

Sample tube 140 preferably is held securely when rotating cylinder 145to preferably allow sensitive and perishable sensitive goods 139 toremain in a fixed position or alternately preferably to rotate uponactivation of at least one gear motor 144, as shown. Sample tube 140 (inthe illustrated embodiment) preferably has an outer diameter of about 3⅞inches and is about 8 inches long, as shown. Sterile centrifuge tubes asproduced by Exodus Breeders Corporation code number 393 preferably maybe used, as shown. Sample tube 140, preferably comprising a size ofabout 50 milliliter (ml), is non-free standing and has a conical end.

Sample assembly frame 141 preferably is in a closely fitted relationshipwithin outer enclosure 105 to minimize vibrations, as shown. Sample tube140 preferably may be in a closely fitted relationship with rotatingcylinder 145 preferably minimizing vibration and the possibility ofphysically damaging sample tube 140, as shown. This arrangementpreferably minimizes potential compromising of the integrity ofsensitive and perishable sensitive goods 139, as well as preferablylessens possible dangers of exposure to user 200. Sample assembly frame141 preferably is about 5 inches high and preferably is made of urethanepreferably smooth-cast-roto-molded, as shown. Sample assembly frame 141preferably consists of at least one upright bar 147, preferably with anouter diameter of about ½ inch and a length of about 5 inches, as shown.Upright bar 147, preferably comprising urethane preferably is frictionfitted through upper frame-plate 138 and preferably lower frame-plate137, as shown. Upright bar 147 preferably protrudes about ½ inchoutwardly from upper side of upper frame-plate 138 and lower side oflower frame-plate 137, as shown. One upright bar 147 preferably isaffixed with at least one connection flat-bar 173 to another upright bar147, preferably to provide structural rigidity for sample assembly frame141, as shown. At least one connection flat-bar 174 preferably connectstwo other upright bars 147. Connection flat-bar 174 preferably comprisesat least one shaft pass-through 175 allowing shaft 146 to pass throughwith at least one bearing 176 to aid rotation, as shown.

Gear motor 144 preferably is fit on end of shaft 146 and preferably heldin place with a hub 188, as shown. Connection flat-bar 173 preferablyprovides a mounting for sample battery pack 143, as shown. Connectionflat-bar 173 preferably is attached to upright bar 147, preferably byadhesive, alternately preferably fusion welding, as shown. Connectionflat-bar 173 preferably prevents twisting of sample assembly frame 141,as shown. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, materials, etc., other attachment methods, such as, forexample, screws, epoxies, soldering, etc., may suffice.

FIG. 6 shows a partially exploded perspective view, illustrating theorder and arrangement of inner-workings assembly 106 of iso-thermaltransport and storage system 100, according to the preferred embodimentof FIG. 1. Embodiment 102 preferably may be used without sample rotatingassembly 109, as shown, and thereby is suitable for handling sensitiveand perishable sensitive goods 139 that do not need to be rotated oragitated to preserve the required quality. Fan 120 preferably blowsambient air pulled in through vent 183, as shown in FIG. 1 and FIG. 4.Heat sink 114 preferably comprises fin 113 preferably mounted orotherwise configured to be perpendicular to fan 120, as shown. Heat sink114 preferably is configured for providing maximum surface area exposureto air currents from fan 120, preferably to maximize the rates ofcooling or heating within embodiment 102, as shown. Preferably, thismethod of forced-convection heat-transfer creates fewer fluctuations intemperature of sensitive and perishable sensitive goods 139 over anyextended time. Upon reading the teachings of this specification, thosewith ordinary skill in the art will now appreciate that, underappropriate circumstances, considering issues such as changes intechnology, user requirements, etc., other heat sink cooling devices,such as aerators, air-conditioners, and ventilators yet to be developed,etc., may suffice.

At least one retainer 112 preferably is attached at its base tothermo-electric assembly 123, and preferably partially wraps aroundvessel 121 preferably permitting user 200 to lift vessel 121 out ofembodiment 102. Retainer 112 preferably is a means to ensure vessel 121is held in place, as shown. Retainer 112 preferably is formed in aU-shape, as shown, and preferably is constructed ofsmooth-cast-roto-molded urethane as made by Smooth-On manufacturers.Smooth-Cast ROTO™ urethane is a semi-rigid plastic and preferably isselected for its density-control, structural and insulatingcharacteristics. Smooth-Cast ROTO™ has a shore D hardness of about 65, atensile strength of about 3400 psi, tensile modulus of about 90,000 psi,with a minimal shrinkage of about 0.01 in/in over a seven-day period.Upon reading the teachings of this specification, those with ordinaryskill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other retaining means, such as catches, clasps,clenches, grips, holds, locks, presses, snaps, vices, magnets, ormechanical attaching means yet to be developed, etc., may suffice.

Retainer 112 according to the present invention may alternatelypreferably be manufactured from aluminum, due to its high thermalconductivity and low mass density. The high thermal conductivity ofretainer 112 preferably efficiently transports heat betweenthermo-electric assembly 123 and vessel 121, preferably with a minimumof temperature difference between thermo-electric assembly 123 andvessel 121. This efficient heat conduction preferably supportstemperature stability for sensitive and perishable sensitive goods 139,contained within vessel 121, as shown. Upon reading the teachings ofthis specification, those with ordinary skill in the art will nowappreciate that, under appropriate circumstances, considering issuessuch as changes in technology, user requirements, etc., other highthermal conductors, such as copper, brass, silver, gold, tungsten andother conductive element alloys yet to be developed, etc., may suffice.

Thermo-electric assembly 123 preferably is mounted on base surface 171of heat sink 114 and preferably connected to retainer 112, as shown.Upon reading the teachings of this specification, those with ordinaryskill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other retaining means, such as catches, clasps,clenches, grips, holds, locks, nippers, presses, snaps, vices, magnets,or mechanical attaching means yet to be developed, etc., may suffice.

Circuit board 117 preferably is mounted substantially parallel tothermo-electric assembly 123 preferably by at least one bracket 110, asshown. Also, circuit board 117 preferably mounts to flat upper surfaceof heat sink 114, as shown. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now appreciatethat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, cost, etc., other circuitboard mountings, such as suspension in foam insulation, epoxies,snap-in, cable suspensions, etc., may suffice.

Circuit board 117 preferably controls and regulates the functioning ofthermo-electric assembly 123, preferably according to electronicfeedback from thermocouple 124 within thermo-electric assembly 123, asalso shown in FIG. 8. At least one mounting hole preferably is presentin circuit board 117 and preferably to allow mounting by bracket 110, asshown. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other mounting means for example hooks, magnets,mechanical fastening means yet to be developed, fusion means, etc., maysuffice.

FIG. 7 shows a partially disassembled bottom perspective view,illustrating inner-workings assembly 106 of iso-thermal transport andstorage system 100, according to the preferred embodiment of FIG. 1.Excess heat preferably is pumped into heat sink 114 from thermo-electricassembly 123 and preferably convectively transferred into ambient air byforced convection from fin 113, by at least one fan 120, as shown.

During time periods when heat must be sourced from the ambient to warmsensitive and perishable sensitive goods 139, such that the temperatureof sensitive and perishable sensitive goods 139 is preferably maintainednear a desired set-point temperature, fin 113, as shown, preferably mayserve to collect heat from the ambient air. Under this alternateoperational mode, at least one fan 120 preferably pushes relatively warmambient air over fin 113, thereby allowing heat to be absorbed into fin113. Such absorbed heat preferably conducts up into thermo-electricassembly 123, where the heat is preferably pumped, as needed, intovessel 121 and thus provides necessary heating to maintain the set-pointtemperature of sensitive and perishable sensitive goods 139.

Control circuit on circuit board 117 enables user 200 to re-setset-point temperature, of sensitive and perishable sensitive goods 139,to the desired temperature at which sensitive and perishable sensitivegoods 139 are maintained (this arrangement at least herein embodyingwherein such step of providing re-use comprises at least one set-pointre-setting step). Upon reading the teachings of this specification,those with ordinary skill in the art will now appreciate that, underappropriate circumstances, considering issues such as changes intechnology, user requirements, etc., other heat-sink heat exchanges,such as fluid cooling through internal flow of liquids, air coolingmeans and other passive or active cooling means yet to be developed,etc., may suffice.

Fan 120 preferably uses at least one blade 128 to pull ambient air intoat least one vent 183, as shown in FIGS. 1 and 4. Further, fan 120preferably blows the ambient air onto heat sink 114, as shown.Embodiment 102 either preferably dissipates excess heat from heat sink114 to the ambient air or alternately preferably extracts heat from theambient air (into heat sink 114), as needed, to maintain the at leastone set-point temperature of sensitive and perishable sensitive goods139, as shown. Also, fan 120 preferably exhausts the ambient air outthrough vent 183, as shown in FIGS. 1 and 4. Fan 120 preferably operatesat low power to pull ambient air into at least one vent 183 andpreferably exhaust the ambient air out through at least one vent 183, asshown in FIGS. 1 and 4. Blade 128 has a steep pitch for preferablysufficient air movement at the hottest rated ambient air temperaturewhile preferably maintaining the lowest rated set-point temperature forsensitive and perishable sensitive goods 139. Input voltage to fan 120preferably is alternately preferably determined by closed-loop feedbacksensing of at least one thermocouple 124, as shown. Upon reading theteachings of this specification, those with ordinary skill in the artwill now understand that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., othercontrollers of forced air movers having for example heat-flux sensors,system voltage sensors yet to be developed, etc., may suffice.

The opening for blade 128 preferably to rotate within fan assembly 127preferably is between about 5 inches and about 8 inches in diameter,depending on volume of airflow needed. Vent 183 preferably is free fromany obstructions to allow proper circulation to occur, as shown in FIGS.1 and 4. Thermo-electric assembly 123 preferably is mounted on basesurface 171 of heat sink 114, as shown. Upon reading the teachings ofthis specification, those with ordinary skill in the art will nowunderstand that, under appropriate circumstances, considering issuessuch as changes in technology, user requirements, etc., other airmovers, such as, for example, turbines, propellers, etc., may suffice.

Thermo-electric assembly 123 comprises at least one thermo-electricsemi-conductor node 133, as shown. More preferably, thermo-electricassembly 123 comprises a plurality of thermo-electric semi-conductornodes 133, as shown. Even more preferably, thermo-electric assembly 123comprises between about six and about nine thermo-electricsemi-conductor nodes 133, preferably electrically connected in series,as shown in FIG. 9A (at least embodying herein wherein said at least onethermo-electric heat pump comprises a minimum of about three sandwichlayers).

The quantity of thermo-electric semi-conductor nodes 133 is preferablydetermined by the total expected variance between a desiredset-point-temperature of sensitive and perishable sensitive goods 139and the ambient temperatures that embodiment 102 will be potentiallysubjected to. Once the set-point-temperature-to-ambient-temperaturerange of sensitive and perishable sensitive goods 139 preferably isdefined, it is divided by a per-unit factor to determine the preferrednumber of thermo-electric semi-conductor nodes 133 that are electricallyconnected in series (and thermally connected in series). The per-unitfactor for bismuth-telluride (Bi₂Te₃) based thermo-electricsemi-conductor nodes, preferably ranges from about 3° C. to about 5° C.Thus, preferably, if the set-point-temperature of sensitive andperishable sensitive goods 139 is about 0° C. and the ambienttemperature is expected to range up to about 27° C.; about six to aboutnine thermo-electric semi-conductor nodes 133 are needed. Thus, thepreferred thermo-electric assembly 123 comprises about six to about ninethermo-electric semi-conductor nodes 133, that preferably areelectrically connected in series (and thermally connected in series), asshown.

The per-unit factor for series-connected thermo-electric semi-conductornodes 133, and preferably is selected to maximize the efficiency of heatpumping across thermo-electric semi-conductor nodes 133. The efficiencyat which thermo-electric semi-conductor nodes 133 pump heat is largelydetermined by the external boundary conditions imposed on heat pumpingacross thermo-electric semi-conductor nodes 133. The most significant ofthese boundary conditions comprise the temperature gradient (change intemperature from the P-side to the N-side of the thermo-electricsemi-conductor node 133) and the level of heat conductivity at thesemi-conductor node boundaries.

Generally, operation that is more efficient correlates with smallertemperature gradients and with higher levels of heat conductivity at thesemi-conductor node boundaries of thermo-electric semi-conductor node133. Thus, preferably thermo-electric assembly 123 has a sufficientlylarge number of thermo-electric semi-conductor nodes 133 electricallyconnected in series (and thermally connected in series) such that nosingle thermo-electric semi-conductor node 133 experiences a temperaturegradient greater than from about 3° C. to about 5° C. Also, preferably,thermo-electric semi-conductor nodes 133 are configured such that thelevel of heat conductivity at each semi-conductor node boundarypreferably approximates the thermal conductivity of aluminum.

The preferred number of thermo-electric semi-conductor nodes 133electrically connected in parallel is preferably determined by the totalheat-rate that must be pumped from, or to, sensitive and perishablesensitive goods 139 such that the temperature of sensitive andperishable sensitive goods 139 preferably may be maintained at, or near,the desired set-point-temperature, preferably within from about 2 degreeC. to about 8 degrees C., preferably within 1 degree C. The heat pumpingcapacity of each thermo-electric semi-conductor node 133, electricallyconnected in parallel (and thermally connected in parallel), preferablydepends on specific characteristics of the specific thermo-electricsemi-conductor node 133, as shown. Thus, a designer of iso-thermaltransport and storage system 100 preferably would consult themanufacturer of the specific thermo-electric semi-conductor node 133 todetermine its rated-heat-pumping-capacity. Additionally, the designer ofiso-thermal transport and storage system 100 preferably would determinethe total heat-rate that must be pumped from, or to, sensitive andperishable sensitive goods 139. Once these factors are known to thedesigner of iso-thermal transport and storage system 100, preferably thedesigner divides the total heat-rate by the rated-heat-pumping-capacityof a single series string of thermo-electric semi-conductor nodes 133,to preferably determine the required number of thermo-electricsemi-conductor nodes 133, which should be electrically connected inparallel (and thermally connected in parallel).

VIP insulation 108 preferably provides a further degree of control overgradual changes in temperature by preferably decreasing heat convection,radiation and conduction and increasing thermal resistance. Preferably,about 2 lb/cu. ft. expanded urethane foam, as produced by Smooth-Onmodel Foam-iT!™, is used for VIP insulation 108. VIP insulation 108preferably comprises three sheets of about ½ inch thickness making atotal thickness of about 1½ inches which is wrapped aroundinner-workings assembly 106, as shown. Height of VIP insulation 108preferably is about 8½ inches, as shown. All VIPs preferably are encasedin urethane foam to minimize damage to VIPs, making embodiment 102 moreshock-resistant, as shown. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now understandthat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other insulating means,such as epoxies, unsaturated polyesters, phenolics, fibrous materialsand foam materials yet to be developed, etc., may suffice.

FIG. 8 shows a side profile view, illustrating thermo-electric assembly123 of iso-thermal transport and storage system 100, according to thepreferred embodiment of the present invention in FIG. 1. The presentinvention preferably attains a high coefficient of performance (COP)using the method herein described. At least one thin non-electricallyconductive layer 131 preferably electrically separates thermo-electriccapacitance spacer block 125 from thermo-electric semi-conductor nodes133, while maintaining thermal conductivity. At least one thin-filmthermal epoxy 135, preferably fills microscopic imperfections betweenthin non-electrically conductive layer 131 and thermo-electriccapacitance spacer block 125 (also see FIG. 8). Upon reading thisspecification, those skilled in the art will now appreciate that, underappropriate circumstances, considering such issues as future technology,cost, application needs, etc., other thermal conductivity maximizers,such as, for example, thermal greases, thermal dopes, molecularlysmoothed surfaces, etc., may suffice.

Thermo-electric assembly 123 preferably comprises a plurality ofthermo-electric semi-conductor nodes 133, preferably connectedphysically (thermally) in series and/or parallel, and electrically inseries and/or parallel, and preferably using at least one battery system119 to create at least one bidirectional heat-pump, as shown. Thisconfiguration preferably provides progressive temperature gradients andprecise temperature control (at least herein embodying wherein suchcontrol of such at least one temperature comprises controlling such atleast one temperature to within a tolerance of less than about onedegree centigrade). Thermo-electric assembly 123 preferably is used toincrease the output voltage since the voltage induced over eachindividual thermo-electric semi-conductor node 133 is small. Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other heating/cooling means for example, thermo-electricrefrigerators, thermo-electric generators yet to be developed, etc., maysuffice.

FIG. 8 shows repetitive layers of thermo-electric capacitance spacerblock 125 and thermo-electric semi-conductor node 133, which comprisethermo-electric assembly 123. Preferably, thermo-electric semi-conductornode 133 comprises bismuth-telluride that preferably is secured withelectrically-conductive thermal adhesive, preferably silver-filledtwo-component epoxy 132, as shown. Thin-film thermal epoxy 135preferably fills any microscopic imperfections at the interface betweeneach layer of thermo-electric capacitance spacer block 125 and thinnon-electrically conductive layer 131, as shown.

Preferably, thermo-electric semi-conductor node 133 comprises banks ofelectrically parallel-connected bismuth-telluride semiconductors thatare in-turn electrically connected in series and interconnected to bothpower supply circuits and sensing/control circuits, as shown.

The overall efficiency of operation of thermo-electric assembly 123preferably is improved with the combination of adding thermalcapacitance, between each electrically series-connected (and thermallyconnected in series) thermo-electric semi-conductor node 133, and theability to independently control the voltage across eachseries-connected thermo-electric semi-conductor node 133 (at leastherein embodying wherein said at least one thermo-electric heat pumpcomprises at least one thermal capacitor adapted to provide at least onethermal capacitance in thermal association with said at least onethermo-electric device).

Preferably, thermo-electric capacitance spacer block 125 is the thermalcapacitance added between each electrically series-connected (andthermally series-connected) thermo-electric semi-conductor node 133, asshown. Also, the voltage, across each electrically series-connected (andthermally series-connected) thermo-electric semi-conductor node 133,preferably is controlled by at least one closed-feedback loop sensorycircuit, as shown. Further, preferably, the voltage, across eachelectrically series-connected (and thermally series-connected)thermo-electric semi-conductor node 133, preferably is independentlycontrolled, as shown. Still further, preferably, theindependently-controlled voltage impressed across each electricallyseries-connected (and thermally series-connected) thermo-electricsemi-conductor node 133, is integrated with adjacent suchindependently-controlled voltages, preferably so as to ensure that undernormal operational conditions, all electrically series-connected (andthermally series-connected) thermo-electric semi-conductor nodes 133pump heat generally in the same direction, as shown. Even further,preferably, any short-term variation in voltage, impressed across eachelectrically series-connected (and thermally series-connected)thermo-electric semi-conductor node 133, preferably is constrained toless than about 1% of the RMS value of the voltage impressed across eachelectrically series-connected (and thermally series-connected)thermo-electric semi-conductor node 133.

At least one thermo-electric capacitance spacer block 125 preferably isabout ¼ inch thick, and preferably is flat with parallel polishedsurfaces, as shown (at least embodying herein wherein such at least onethermal capacitance is user-selected to provide intended thermalassociation with said at least one thermo-electric device). At least onethermo-electric capacitance spacer block 125 preferably has slightindentations on parallel surfaces to allow the assembler to alignthermo-electric capacitance spacer block 125 with thermo-electricsemi-conductor node 133 while assembling thermo-electric assembly 123.Aluminum alloy 6061 preferably is used because of its lightweight,relatively high yield-strength of about 35000 psi, corrosion resistance,and excellent machinability. Preferred aluminum alloy 6061 is resistantto stress corrosion cracking and maintains its strength within atemperature range of about −200° C. to about +165° C. Preferred aluminumalloy 6061 is sold by McMaster-Carr as part number 9008K48. Alternatelypreferably, thermo-electric capacitance spacer block 125 comprisescopper and copper alloys, which provide needed levels of thermalconductivity, but are not as advantageous as aluminum alloys relative tostructural strength and weight considerations.

Thermo-electric capacitance spacer block 125 preferably is ‘sandwiched’between each thermo-electric semi-conductor node 133 in thermo-electricassembly 123, as shown (at least embodying herein wherein each suchsandwich layer comprises at least one set of said thermo-electricdevices and at least one set of said thermal capacitors).Thermo-electric capacitance spacer block 125 preferably, during normaloperation, provides delayed thermal reaction time (stores heat), and inconjunction with controlled operation of a plurality of thermo-electricsemi-conductor nodes 133, may act to minimize variations in temperatureswings for sensitive and perishable sensitive goods 139 (at least hereinembodying wherein said intended thermal association of such at least oneleast one thermal capacitance is user-selected to provide increasedenergy efficiency of operation of said at least one thermo-electricdevice as compared to said energy efficiency of operation of said atleast one thermo-electric device without addition of said at least oneleast one thermal capacitor).

Circuit board 117 preferably is mounted and wired to controlthermo-electric assembly 123 as shown. Circuit board 117 housescircuitry (see FIG. 11) for connecting at least one thermocouple 124such that at least one thermocouple 124 acts as a one-wire programmabledigital thermometer to measure at least one temperature at thermocouple124, as shown. Circuitry on circuit board 117 preferably also providesat least one feedback loop for control of voltage and power feeds to atleast one plurality of thermo-electric semi-conductor nodes 133.

Silver-filled two-component epoxy 132 preferably is a thermal adhesive(at least embodying herein wherein each such sandwich layer is suitablefor thermally-conductively connecting to at least one other suchsandwich layer; and wherein thermal conductance between essentially allsuch attached sandwich layers is greater than 10 watts per meter perdegree centigrade; and wherein thermal conductance between essentiallyall such attached sandwich layers is greater than 10 watts per meter perdegree centigrade). Silver-filled two-component epoxy 132 preferably hasa specific gravity of about 3.3, preferably is non-reactive andpreferably is stable over the operating temperature range of embodiment102. Silver-filled two-component epoxy 132 preferably is part numberEG8020 from AI Technology Inc. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now understandthat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other materials with ahigh Seebeck coefficient, such as uranium dioxide, Perovskite® and othersuch materials yet to be developed, etc., may suffice.

Metal-to-metal contact is ideal for conducting the maximum heattransfer. However, a minute amount of thin-film thermal epoxy 135applied provides filling of any air pockets and may increase thermalconduction between thermo-electric capacitance spacer block 125 andthermo-electric semi-conductor node 133 as shown in FIG. 8. Trapped airis about 8000 times less efficient at conducting heat than aluminum;therefore, thin-film thermal epoxy 135 preferably is used to minimizelosses in interstitial thermal conductivity, as shown. The increase inefficiency is realized because the effective contact-surface-area ismaximized, thereby preferably minimizing hot and cold spots that wouldnormally occur on the surfaces. The uniformity increases the thermalconductivity as a direct result. Thin-film thermal epoxy 135 is oftenapplied on both surfaces with a plastic spatula or similar device.Conductivity of thin-film thermal epoxy 135 is poorer than the metals itcouples, therefore it preferably is important to use no more than isnecessary to exclude any air gaps. Upon reading the teachings of thisspecification, those with ordinary skill in the art will now understandthat, under appropriate circumstances, considering issues such aschanges in technology, user requirements, etc., other conductorenhancements, such as, for example, other thermal adhesives, materialfusion, conductive fluids or other such conductor enhancers yet to bedeveloped, etc., may suffice.

FIG. 9A shows an electrical schematic view, illustrating electricalcontrol of iso-thermal transport and storage system 100, according tothe preferred embodiment of FIG. 1. According to preferred embodimentsof the present invention, the multiple temperature staging processpreferably is accomplished by having at least two thermo-electricsemi-conductor nodes 133 that, when wired in series, preferably combineto form thermo-electric assembly 123, as shown. Additionalthermo-electric semi-conductor nodes 133 preferably may be electricallyseries-connected (and thermally series-connected) or electricallyparallel connected (and thermally series-connected) preferably to extendthe heat-pumping capabilities of thermo-electric assembly 123, as shown.

Individual battery cells in at least one battery system 119 preferablymay be wired to preferably switch between combinations of series and/orparallel depending on specific power available or if user 200 desiresthat particular design, as shown. At least one serial/parallelconversion relay 187 preferably provides switching between combinationsof series and/or parallel modes. Serial/parallel conversion relay 187preferably comprises double pole double throw (DPDT). Serial/parallelconversion relay 187 preferably further comprises a latching type ofrelay, which does not require continuous power to remain in eitherposition. Upon reading the teachings of this specification, those withordinary skill in the art will now appreciate that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other relay switching means, such as dual coil,non-latching, reed relays, pole and throw relays, mercury-wetted relays,polarized relays, contactor relays, solid-state relays, Buchholz relays,or other current switching means yet to be developed, etc., may suffice.

When increased voltage is supplied to selected layers of thermo-electricassembly 123 these sandwiched layers preferably are capable of pumpingheat at higher rates, as required to ensure that the temperature ofsensitive and perishable sensitive goods 139 preferably is maintainedover a wide range of ambient conditions, as shown. This variation inheat pumping rate with each sandwiched layer of thermo-electric assembly123 is allowed since at least one thermo-electric capacitance spacerblock 125 preferably is provided between each thermo-electricsemi-conductor node 133, as shown. Each at least one thermo-electriccapacitance spacer block 125 preferably allows a buffering (momentarystorage) of heat between adjacent thermo-electric semi-conductor nodes133, as shown. This buffering preferably allows each thermo-electricsemi-conductor node 133 flexibility to preferably pump heat at varyingrates while preferably maintaining overall heating or cooling rates asrequired so as to preferably maintain sensitive and perishable sensitivegoods 139 at or near its desired temperature set-point. Upon reading theteachings of this specification, those with ordinary skill in the artwill now understand that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., otherisolating means for example shims, blocks, chocks, chunks, cleats,cotters, cusps, keystones, lumps, prongs, tapers made of metallic andnon-metallic materials yet to be developed, etc., may suffice.

Battery system 119 preferably may comprise three each about 1.2 volt DCrechargeable batteries wired in series to thermo-electric assembly 123.Nominal capacity of this preferred configuration of battery system 119is about 10000 ampere-hour (Ah) with a minimum capacity of about 9500milliampere-hour (mAh) per 1.2 VDC rechargeable battery. Maximumcharging current of this preferred configuration of battery system 119is about of about 5 A. Battery system 119 preferably comprises Powerizerrechargeable battery part number MH-D10000APZ, preferably having amaximum discharging current of about 30 A. Preferably, dimensions ofeach battery are about 1.24 inches by about 2.36 inches. Preferably,each battery weighs about 5.7 ounces and has a cycle performance ofabove about 80% of initial capacity at 1000 cycles at about 0.1° C.discharge rate.

Heat pumping rates, between sensitive and perishable sensitive goods 139and the ambient air surrounding iso-thermal transport and storage system100, preferably may be actively increased or decreased bythermo-electric assembly 123 within iso-thermal transport and storagesystem 100, as shown. The direction of the heat pumping within thissystem preferably is fully reversible and available upon instant demand.Changing the polarity of the voltage of battery system 119, as appliedacross thermo-electric assembly 123, preferably causes heat to be pumpedin opposite directions (either from the ambient surrounding iso-thermaltransport and storage system 100 to sensitive and perishable sensitivegoods 139, or from sensitive and perishable sensitive goods 139 to theambient surrounding iso-thermal transport and storage system 100).Changes in the level of voltage, at which power from battery system 119is applied across thermo-electric assembly 123, preferably cause heat tobe pumped, by thermo-electric assembly 123, at greater or lesser rates.The combination of controlling the polarity, and the magnitude, ofvoltage from battery system 119 preferably allows sensitive andperishable sensitive goods 139 preferably to be maintained near apredetermined set-point temperature. The predetermined set-pointtemperature preferably is maintained as the ambient temperature varieswidely. This allows the integrity of sensitive and perishable sensitivegoods 139 preferably to be maintained over a wide range of ambientconditions. Also, this allows the integrity of sensitive and perishablesensitive goods 139 preferably to be maintained for longtransporting-distances, or long storage-time periods, or both. Theduration of the long transporting-distances or the long storage-timeperiods is largely determined by a combination of the total storedenergy in battery system 119 and the rate at which that energy isdissipated into thermo-electric assembly 123, as shown. Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., othervoltage regulating means for example multi-output pulse-width modulationpower supplies, flyback-regulated converters, magneticamplifier/switching power supplies yet to be developed, etc., maysuffice.

FIG. 9B shows an electrical schematic view, illustrating an alternatelypreferred electrical control of iso-thermal transport and storage system100, according to the preferred embodiment of FIG. 1.

Thermo-electric assembly 123 alternately preferably may operate withpulse-width modulation based voltage control, as shown. Such pulse-widthmodulation voltage control is not limited to about 1.2, 2.4, 3.6, 4.8 or12 VDC battery-string voltages. Rather, the pulse-width modulation basedvoltage control preferably can be varied as needed to achieveintermediate voltages consistent with maintaining constant temperaturewithin at least about 1° C., as shown in FIG. 9B (at least hereinembodying wherein such control of such at least one temperaturecomprises controlling such at least one temperature to within atolerance of less then one degree centigrade).

Pulse-width modulation preferably uses a square wave, wherein the dutycycle is modulated, so as to vary the average value of the resultingvoltage waveform. The output voltage of the pulse-width modulationvoltage-control preferably is smooth, as shown. The output voltagepreferably has a ripple factor of less than about 10% of the RMS (rootmean square) output voltage, and preferably results in less than about1% variation in the change in temperature across thermo-electricassembly 123 (at least herein embodying wherein said intended thermalassociation is user-selected to control usage of proportional controlcircuitry in combination with at least one energy store to power said atleast one thermo-electric heat pump to control such at least onetemperature of the temperature-sensitive goods).

At least one DC/DC converter 129 preferably is a switch-mode converter,which preferably provides output voltages that are greater than itsinput voltage, as shown. Input voltage for DC/DC converter 129, aspreferably utilized in iso-thermal transport and storage system 100,preferably is sourced from at least one battery system 119. DC/DCconverter 129 preferably provides output power at voltages in excess ofbattery system 119, as shown. This attribute of DC/DC converter 129preferably allows substantial flexibility in the operation ofiso-thermal transport and storage system 100, particularly the operationof fan 120, as shown. Powering fan 120 at higher input voltages, areavailable directly from battery system 119, results in fan 120 operatingat higher speeds (revolutions per minute) and thus higher cooling rates.Thus, varying the input voltage into fan 120 also preferably varies theability of iso-thermal transport and storage system 100 to dissipateheat. Increasing input voltage into fan 120, above the output voltageavailable from battery system 119, also preferably increases the highestambient temperatures at which iso-thermal transport and storage system100 can operate. Additionally, increasing the voltage acrossthermo-electric assembly 123 also preferably increases the rate at whichthermo-electric assembly 123 pumps heat from sensitive and perishablesensitive goods 139 to the ambient (when operating in cooling mode), orfrom the ambient to sensitive and perishable sensitive goods 139 (whenoperating in heating mode). Thus, the addition of DC/DC converter 129preferably is highly useful for extending the operational flexibilityiso-thermal transport and storage system 100.

Power from battery system 119, entering into DC/DC converter 129 ordirectly into at least one thermo-electric semi-conductor node 133,preferably exits passing through at least one relay 178 and at least onerelay 179. Relay 178 and relay 179 preferably are momentary latchingrelay(s) that preferably perform as electrical switches that preferablyopen and close under of at least one control of monitoring circuitry oncircuit board 117. Relay 178 and relay 179 are preferably latchingrelays, meaning they require control power only during the time thatthey switch from their on-to-off state or switch from off-to-on state,thus minimizing control power usage (at least embodying herein whereinsaid intended thermal association of such at least one thermalcapacitance is user-selected to allow usage of momentary-relay-basedcontrol circuitry in combination with at least two energy stores topower said at least one thermo-electric device to achieve control of atleast one temperature of the temperature-sensitive goods).

Relay 178 and relay 179 preferably are double pole, double throw (DPDT),preferably latching-style relays. Relay 178 and relay 179 preferably aredigital, high-sensitivity low-profile designs, which may withstandvoltage surges meeting FCC Part 68 regulation. Relay 178 and relay 179preferably are a low-signal style G6A as manufactured by Omron. Astandard dual-coil latching relay 178 and relay 179 preferably are partnumber G6AK-234P-ST-US. Specifications on this preferred relay include arated voltage of about 5 VDC, a rated current of about 36 mA and a coilresistance of about 139 ohm (a). A minimal power preferably is consumedduring the latching operation of relay 178 and relay 179. Upon readingthe teachings of this specification, those with ordinary skill in theart will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other relay switching means, such as dual coil, non-latching, reedrelays, pole and throw relays, mercury-wetted relays, polarized relays,contactor relays, solid-state relays, Buchholz relays, or other currentswitching means yet to be developed, etc., may suffice.

Iso-thermal transport and storage system 100 preferably operates mostefficiently when thermo-electric assembly 123 is electrically wired inseries, as shown. However, thermo-electric assembly 123 preferably maybe wired in various combinations of series and parallel, as a means ofadjusting the heat-pumping rate, as shown. Thus, iso-thermal transportand storage system 100 preferably operates efficiently when the wiringof thermo-electric assembly 123 preferably can be switched as needed tomirror the heat-pumping demand, as that demand changes with time, asshown. Iso-thermal transport and storage system 100 preferably providessuch operational efficiently by switching the input voltages intothermo-electric assembly 123 using at least one relay 178 and at leastone relay 179. At least one relay 178 and at least one relay 179preferably switch available voltages, from battery system 119, withoutcontinuously dissipating energy. Monitoring circuitry on circuit board117 preferably monitors the status of at least one relay 178 and atleast one relay 179 to preferably prevent unnecessary energizing ofoutputs if at least one relay 178 and at least one relay 179 are alreadyat a desirable position (at least herein embodying wherein said at leastone thermo-electric heat pump comprises at least one first such sandwichlayer comprising such set of said thermo-electric devices; wherein eachthermo-electric device comprising said plurality is electricallyconnected in parallel with each other each thermo-electric devicecomprising said plurality; and wherein each of set of saidthermo-electric devices comprising such first sandwich layer isthermally connected in series with each other sandwich layer). Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other power conservation means other energy-efficient switchingmeans, such as control devices, incremental power storage means yet tobe developed, etc., may suffice.

At least one DC/DC converter 129 preferably utilizing pulse-widthmodulation (hereinafter “PWM”) may be incorporated into circuitry oncircuit board 117 preferably to boost voltage to thermo-electricsemi-conductor nodes 133 preferably when higher rates of heat pumping isrequired. Such higher voltages, applied to thermo-electricsemi-conductor nodes 133, preferably permit higher rates-of-change intemperature, thus preferably increasing the heat transfer rate in thatportion of thermo-electric assembly 123, as shown. This preferably actsto remove excessive heat from the portions of thermo-electric assembly123, as shown. Once the temperature of sensitive and perishablesensitive goods 139 is normalized, the system may preferably return tonormal high efficiency operation.

FIG. 10 shows a perspective view illustrating preferred embodiment 102,of iso-thermal transport and storage system 100 as viewed fromunderneath, of the present invention in FIG. 1. Safety on/off switch 118preferably is mounted on horizontal upper-surface 191 (see FIG. 3) ofbase portion 190. Base portion 190 preferably measures about 9 incheswide by about 9 inches long. User 200 preferably activates ordeactivates safety on/off switch 118 on iso-thermal transport andstorage system 100, preferably by moving it to the appropriate position.At least one recess 192 preferably is provided, as shown, preferably toallow safety on/off switch 118 to be protected from accidental switchingcausing iso-thermal transport and storage system 100 to cease operation.This recessed design of safety on/off switch 118 preferably serves toprevent iso-thermal transport and storage system 100 from operating whennot required or, more dangerously, preferably not operating whennecessary. A simple mishap such as inadvertently bumping the switch tothe off position may allow iso-thermal transport and storage system 100to return to ambient environmental temperature, which may damage ordestroy sensitive and perishable sensitive goods 139. The danger inaccidental shutoff of safety on/off switch 118 is that at least onerequired temperature-range of sensitive and perishable sensitive goods139 protected in vessel 121 is compromised. Recess 192 preferably isabout 1⅓ inches wide, about ⅞ inch long and about 1 inch deep. Uponreading the teachings of this specification, those with ordinary skillin the art will now appreciate that, under appropriate circumstances,considering issues such as changes in technology, user requirements,etc., other switching means for example, actuators, triggers, activatorsor other such switching means yet to be developed, etc., may suffice.

Embodiment 102 is designed to be hardened relative to mechanical shock,thereby creating extended expected usable-life and cost-effectivenessfor user 200, during normal transport and storage conditions, as shown.Upon reading the teachings of this specification, those with ordinaryskill in the art will now understand that, under appropriatecircumstances, considering issues such as changes in technology, userrequirements, etc., other shock protectors, such as, for example, pads,buffers, fillings, packings or other such shock protecting means yet tobe developed, etc., may suffice.

FIG. 11 shows a schematic view, illustrating a control circuit board,according to the preferred embodiment of the present invention inFIG. 1. Circuit board 117 preferably uses a series P-1 linear analogcontroller 315, preferably PIC-16F88-1/P, with an output of 0-5 VDC,corresponding to a thermistor range of about 0-50 thousand ohms (KΩ) orabout 0-500 KΩ. Series P-1 linear analog controller 315 preferably isprovided with temperature set-point, maximum current set-point, loopgain and integral-time single-turn adjustment potentiometers. Highcurrent-levels may be applied to control actuators, preferably relay 178and relay 179, while preferably maintaining low power on circuit board117. Heat preferably may be pumped in either direction, to or away from,sensitive and perishable sensitive goods 139, as shown in FIG. 6according to desired temperature setting (set-point temperature ofsensitive and perishable sensitive goods 139). Upon reading theteachings of this specification, those with ordinary skill in the artwill now appreciate that, under appropriate circumstances, consideringissues such as changes in technology, user requirements, etc., othercontroller means, such as other circuit boards, temperature monitors yetto be developed, etc., may suffice.

FIG. 11 shows the control circuit board physical layout for circuitboard 117. FIG. 11 shows a preferable pin-configuration for relay-driverdevice ULN2803 310. FIG. 11 also shows a preferable pin-configurationfor series P-1 linear analog controller 315. Additionally, FIG. 11further shows preferred pin-configurations for relay 178 and relay 179.Potential additional control relays R3, R4, R5, and R6 are also shown inFIG. 11. Upon reading this specification, those skilled in the art willnow appreciate that, under appropriate circumstances, considering suchissues as future technologies, cost, space limitations, etc., othercircuit board layouts, such as, for example, single integrated chiplayouts, size variant layouts (longer, wider, shorter, etc.), stackedlayouts, multi-board layouts, etc., may suffice.

The wiring connections between thermo-electric assembly 123 and at leastone battery system 119 preferably use soldered connections, as shown.Circuit board 117 preferably comprises G10 epoxy-glass board, preferablyabout 1/16 inches thick, about 2½ inches wide and about 3⅞ inches long,preferably with one-ounce etched-copper conductors on at least one side,as shown.

Solder comprises a fusible metal alloy, preferably with a melting rangeof about 90° C. to about 450° C. Solder preferably is melted to join themetallic surfaces of the wire 177 to circuit board 117. Flux cored wiresolder preferably is used, such as Glow Core, marketed by AIM. Solderpreferably is lead-free compatible, preferably has excellent wettingproperties, preferably has a wide process-time window and preferably iscleanable with a CFC-free cleaning solution, designed for use inultrasonic cleaning or spray and immersion systems, preferably TotalClean 505 as manufactured by Warton Metals Limited. Alternatelypreferably, other metals such as tin, copper, silver, bismuth, indium,zinc, antimony, or traces of other metals may be used within the soldermixture. Also, lead-free solder replacements for conventional tine-lead(Sn60/Pb40 and Sn63/Pb37) solders, preferably having melting pointsranging from about 118° C. to about 340° C., which do not damage oroverheat circuit board 117 during soldering processes, are utilized.

Alternately preferably, other alloys, such as, for example,tin-silver-copper solder (SnAg_(3.9)Cu_(0.6)) may be used, because it isnot prone to corrosion or oxidation and has resistance to fatigue.Additionally, preferably, mixtures of copper within the solderformulations lowers the melting point, improves the resistance tothermal cycle fatigue and improves wetting properties when in a moltenstate. Mixtures of copper also retard the dissolution of copper fromcircuit board 117. Upon reading the teachings of this specification,those with ordinary skill in the art will now appreciate that, underappropriate circumstances, considering issues such as changes intechnology, user requirements, etc., other wiring controlling means,such as boards, cards, circuit cards, motherboards yet to be developed,or other combinations of solder including SnAg_(3.0)Cu_(0.5),SnCu_(0.7), SnZn₉, SnIn_(8.0)Ag_(3.5)Bi_(0.5), SnBi₅₇Ag₁, SnBi₅₈, SnIn₅₂and other possible flux and alloy solder formulations, etc., maysuffice.

FIG. 12A illustrates a preferred embodiment of thermoelectric heat pumpassembly 310. In this preferred embodiment, thermoelectric heat pumpassembly 310 has a top end 312 and a bottom end 314, thermoelectric heatpump assembly 310 comprising at least one thermoelectric unit layer 320capable of active use of the Peltier effect. Thermoelectric heat pumpassembly 310 further comprises a capacitance spacer block 125 suitablefor storing heat and providing a delayed thermal reaction time of theassembly 310, wherein the capacitance spacer block 125 is thermallyconnected to thermoelectric unit layer 320. Assembly 310 furthercomprises: at least one energy source 340 operably connected to the atleast one thermoelectric unit layer 320, wherein the energy source 340is suitable to provide a current; a heat sink 114 associated with a fanassembly 127, wherein in the heat sink 114 is thermally connected at thebottom end of the heat pump assembly 310, the heat pump assembly 310being thermally connected to an isolation chamber 336, and wherein thethermoelectric heat pump assembly 310 further comprises a circuit board117.

FIG. 12B shows a top view of another preferred embodiment ofthermoelectric transport and storage device 102, showing: a thermalisolation chamber 336, an LCD display 386, at least one energy source340, and a DB connector 384.

FIG. 13A shows another preferred embodiment of thermoelectric heat pumpassembly 310, the assembly 310 comprising: two thermoelectric unitlayers 320 capable of active use of the Peltier effect, eachthermoelectric unit layer 320 having a cold side 322 and a hot side 324(See FIG. 15); at least one capacitance spacer block 125 suitable forstoring heat and providing a delayed thermal reaction time of theassembly 310, the capacitance spacer block 125 being between a firstthermoelectric unit layer 332 and a second thermoelectric layer 334 (SeeFIG. 15), wherein the top portion 326 of the capacitance spacer block125 is thermally connected to the hot side 324 of the firstthermoelectric unit layer 332 and the bottom portion 328 is thermallyconnected to the cold side 322 of the second thermoelectric unit layer334 (See FIG. 15), thereby forming a sandwich layer 330 suitable to pumpheat from the first thermoelectric unit layer 332 to the secondthermoelectric layer 334 (See FIG. 15); and a heat sink 114 associatedwith a fan assembly 127, wherein the heat sink 114 is thermallyconnected at the bottom end 314 of the heat pump assembly 310.

FIG. 13B shows a perspective view of another preferred embodiment ofthermoelectric transport and storage device 102, wherein the transportand storage device 102 includes: a thermal isolation chamber 336, arobust shock proof exterior 370, an LCD display 386, at least one energysource 340, and a DB connector 384.

FIG. 14 shows a perspective view, illustrating a portable microprocessor380, according to a preferred embodiment of the present invention. Inone embodiment, a portable microprocessor 380 may be utilized tocommunicate with the thermoelectric transport or storage device 102 (SeeFIG. 13B) to send and receive time and temperature profiles related tothe thermoelectric heat pump 310. The sending and receiving of time andtemperature profiles between the portable microprocessor 380 andthermoelectric transport or storage device 102 may either be directlythrough DB connectors 384 or alternatively through radio-frequencyidentification (RFID) tags. When the portable microprocessor 380 issending or receiving time and temperature profiles directly through theDB connectors 384 or RFID tag the thermoelectric transport or storagedevice's 102 energy source 340 may supply the needed power to activatethe portable microprocessor 380. The amount of power generally needed toactivate the portable microprocessor 380 is 5 volts. Upon activation,the portable microprocessor 380 may then communicate with anelectrically-erasable programmable ROM (EEPROM) rewritable memory chip382 operatively associated with the thermoelectric transport or storagedevice 102. Such communication between the portable microprocessor 380and EEPROM rewritable memory chip 382 may be through a serial protocolby way of a multi-master serial computer bus. During communication theportable microprocessor 380 may also receive the time and temperatureprofiles from the EEPROM rewritable memory chip 382 and configure newtime and temperature profiles for the EEPROM rewritable memory chip 382relating to the thermoelectric heat pump 310. For instance, the portablemicroprocessor 380 may reconfigure the time for activating a series ofthermoelectric unit layers 320 upon reaching a specified temperature.

FIG. 15 shows a side profile view, illustrating a sandwich layer 330,according to a preferred embodiment of the present invention. Thesandwich layer 330 comprises at least one capacitance spacer block 125suitable for storing heat and providing a delayed thermal reaction timeof the assembly 310, the capacitance spacer block 125 having a topportion 326 and a bottom portion 328 and being between a firstthermoelectric unit layer 332 and a second thermoelectric layer 334,wherein the top portion of the capacitance spacer block 125 is thermallyconnected to the hot side 324 of the first thermoelectric unit layer 332and the bottom portion 328 is thermally connected to the cold side 322of the second thermoelectric unit layer 334, thereby forming a sandwichlayer 330 suitable to pump heat from the first thermoelectric unit layer332 to the second thermoelectric layer 334.

FIG. 16 shows a microprocessor 350 operatively associated with thethermoelectric heat pump assembly 310. As shown, microprocessor 350communicates with EEPROM chip 382 to obtain instructions for operatingat least one double-pole double-throw (DPDT) relay 360-364. Thecommunication between microprocessor 350 and EEPROM chip 382 may includethe sequencing of DPDT relays 360-364. For instance, microprocessor 350may communicate with relays 360-364 to place thermoelectric unit layers320 in series or parallel depending on the temperature of a canister,wherein the canister is comprised of the thermal isolation chamber 336(see FIG. 12A).

Other communication between microprocessor 350 and DPDT relays 360-364may include allocating power from battery 119 or alternative 5 voltdirect-current (DC) transformer to various parts of the thermoelectrictransport or storage device 102, such as fan assembly 127 (see FIG.12A). A DC-to-DC converter, consisting of an inverter followed by astep-up or step-down transformer and rectifier may also be used tosupply direct-current to microprocessor 350. In addition, microprocessor350 communicates with LCD display 386 (see FIG. 12B) to conveyinformation wherein microprocessor 350 is powered by a 3.6 volt batterypack which is connected by way of a master power switch.

In another embodiment, as shown in FIG. 17, a portable microprocessor380 i.e., “Smartdevice” (see FIG. 14) communicates with EEPROM chip 382through a multi-master serial computer bus using I2C protocol to conveytime and temperature profiles relating to the thermoelectric unit layers320. Initially, as the power is turned on for the thermoelectrictransport or storage device 102, all relays 360-364 are initially off.Next, microprocessor 350 of thermoelectric transport or storage device102 checks for the presence of a portable microprocessor 380. If aportable microprocessor 380 is found the microprocessor 350 waits foroperations to complete and ask user to reset. From this point,microprocessor 350 reads operating parameters from EEPROM chip 382.Microprocessor 350 may then receive temperature protocols and auxiliaryoperations of charging battery and recording EEPROM chip 382.

As shown in FIG. 17 and FIG. 18, temperature control subroutines areconveyed by microprocessor 350 to relays 360-364. The subroutines,define a setpoint temperature (Tsp) and control relays 360-364 to placethermoelectric unit layers 320 in series or parallel depending on Tspand canister temperature (Tc), wherein the canister is comprised of thethermal isolation chamber 336 (see FIG. 12A). For instances, in oneembodiment the subroutines may include the following instructions: 1) ifTc<Tsp, then turn relay off; 2) if Tc>(Tsp+0.1° C.), then switch to 95and 2.4 volt mode; 3) if Tc>(Tsp+0.2° C.), then switch to 4&5S and 2.4volt mode; 4) if Tc>(Tsp+0.3° C.), then switch to 35 and 2.4 volt mode;4) if Tc>(Tsp+0.5° C.), then switch to 4&5S and 4.8 volt mode; 5) ifTc>(Tsp+0.7° C.), then switch to 3S and 4.8 volt mode; 6) if the batterycharger is connected, then force 4.8 volt battery relay on; and 7) ifbatter charger is disconnected; then switch to normal 2.4 volt/4.8 voltoperation.

As shown in FIG. 18, in another embodiment the subroutines may includethe following instructions: 1) if Tc<Tsp, then turn relay off 2) ifTc>(Tsp+0.1° C.), then switch to 6S and 3.6 volt mode; 3) ifTc>(Tsp+0.2° C.), then switch to 3S and 3.6 volt mode; 4) ifTc>(Tsp+0.3° C.), then switch to 2S and 3.6 volt mode; and 5) ifTc>(Tsp+0.5° C.), then switch to 15 and 3.6 volt mode. In yet anotherembodiment, the subroutines may include the following instructions: 1)if Tc<Tsp, then turn relay off; 2) if Tc>(Tsp+0.2° C.), then switch to2S and 3.6 volt mode; and 3) if Tc>(Tsp+0.5° C.), then switch to 1S and3.6 volt mode.

FIGS. 19-22 show wiring diagrams for the temperature control subroutinesconveyed by microprocessor 350 to relays 360-364 for thermoelectrictransport or storage device 102. For example, FIG. 19 shows DPDT masterrelay 361 and multiple DPDT relays 362 configured in a 2S-2.4 volt modesuch as when Tc>(Tsp+0.3° C.) and wherein one relay 362 is in theon-position for 4S mode. In addition, FIG. 19 shows DC-to-DC converter392 in connection with fan DPDT latching relay 361 which is inconnection with battery charge DPDT standard relay 364. DPDT relays 362receive instructions from master DPDT latching relay 361 which placesDPDT relays 362 in 2S&4S mode as well as thermoelectric unit layers 320,wherein the thermoelectric transport or storage device 102 comprises 8thermoelectric unit layers 320.

Similar to FIG. 19, FIGS. 20-21 also show different modes relating todifferent scenarios involving 2 to 12 thermoelectric unit layers 320.For example, FIG. 20 shows the wiring diagram for a thermoelectrictransport or storage device 120 comprising 2 thermoelectric unit layers320. FIG. 21 shows the wiring diagram for a thermoelectric transport orstorage device 120 comprising 12 thermoelectric unit layers 320. Asshown in FIG. 21, utilizing 12 thermoelectric unit layers 320 allowsthermoelectric transport or storage device 102 to switch between 2S, 3S,4S, 6S, and 12S mode.

More specifically, FIG. 22 shows which DPDT relays 362 (labeled R1-R11)are in the on and off position relating to a specific mode for athermoelectric transport or storage device 120 comprising 9thermoelectric unit layers 320. For example, in a 9S-2.4 volt mode R3-R9are in the off-position, R10 and R11 are in the on-position. In a4&5S-2.4 volt mode R4-R9 are in the off-position, R3, R10 and R11 are inthe on-position. In a 3S-2.4 volt mode R3 and R5-R9 are in theoff-position, R4, R10 and R11 are in the on-position. In a 9S-3.6 voltmode R3-R7, R10, and R11 are in the off-position, R8 and R9 are in theon-position. In a 4&5S-3.6 volt mode R4-R7, R10 and R11 are in theoff-position, R3, R8 and R9 are in the on-position. In a 3S-3.6 voltmode R3, R5-R7, R10 and R11 are in the off-position, and R4, R8, and R9are in the on-position. In a 9S-4.8 volt mode R3, R4 and R8-R10 are inthe off-position, and R5-R7 are in the on-position. In a 4&5S-4.8 voltmode R4 and R8-R11 are in the off-position, and R3, as well as R5-R7 arein the on-position. In a 3S-4.8 volt mode R3 and R8-11 are in theoff-position, and R4-R7 are in the on-position. In the various forgoingmodes for FIG. 22, R1 and R2 are utilized depending on the Tsp and heatsink. Switching thermoelectric unit layers 320 between modes allows thethermoelectric transport or storage device 102 to more efficientlyutilize energy source 340.

FIG. 23 shows two charts, each of which illustrate how preferredembodiments of the present invention are configured to maximizeefficiency of operation compared to previously available thermoelectricheat pump systems. For example, preferred embodiments of the heat pumpassembly of the invention is configured so that each thermoelectric unitlayer at steady-state during operation has ratio of the heat removeddivided by the input power (COP) that is prior to and less than the peakCOP on a COP curve of performance (See infra FIGS. 29A-C and 30A-C).

FIGS. 24A-27 show the thermoelectric unit layers 320 of thermoelectrictransport or storage device 102. More specifically, FIG. 24A shows a 6layer thermoelectric unit layer 320 in series, as well as in 6S-3.6 voltmode wherein thermoelectric unit layers 320 receive current from energysource 340 in order to create a heat pump which draws heat from thermalisolation chamber 336 to heat sink 114. Each thermoelectric layer 320comprises capacitance spacer block 125, cold side 322 of thermoelectricunit layer 320, and hot side 324 of thermoelectric unit layer 320,wherein first thermoelectric unit layer 332 is adjacent to thermalisolation chamber 336. In the 6S-3.6 volt mode heat is transferred fromthermal isolation chamber 336 to heat sink 114. Similar to FIG. 24A,FIG. 24B shows a 6 layer thermoelectric unit layer 320. However, FIG.24B shows the 6 layer thermoelectric unit layer 320 wherein 3thermoelectric unit layers 320 are in 2 sets of series, corresponding toa 3S-3.6 volt mode.

FIGS. 25A and 25B show 9 layer thermoelectric unit layer 320 stacks. InFIG. 25A all 9 thermoelectric unit layers 320 are in series andcorrespond to a 9S-4.8 volt mode. In FIG. 25B the 9 layer thermoelectricunit layers 320 are broken into one set of 5 thermoelectric unit layersin series and one set of 4 thermoelectric unit layers in series,corresponding to a 4&5S-4.8 volt mode. FIG. 26A shows the 9 layerthermoelectric unit layer 320 stack in three sets of 3 thermoelectricunit layers in series.

FIG. 26A shows how the thermoelectric unit layer 320 stacks may beplaced in parallel when one thermoelectric unit layer 320 stack is notsufficient. FIGS. 27A and 27B show a 2 layer thermoelectric unit layer320 wherein FIG. 27A is in 2S-3.6 volt mode and FIG. 27B is in 1S-3.6volt mode. As previously stated, switching thermoelectric unit layers320 between modes allow the thermoelectric transport or storage device102 to more efficiently utilize energy source 340 while maintaining adesired Tc.

FIGS. 28A and 28B further emphasize advantages of thermoelectrictransport or storage device 102, (see FIG. 13B), wherein the maximumcurrent, current, maximum Delta-T, Delta-T, transferred heat, voltage,ratio of current to maximum current, ratio of Delta-T to maximumDelta-T, are displayed. FIG. 28A further shows the 1S mode and 2S modeat Delta-T of 20.9° C. and 39.4° C. Likewise, FIG. 28B shows a 15 and 2Smode at Delta-T of 10° C., 20° C. and 40° C. However, FIG. 28B definesvalues for heat transferred Q. FIG. 29A shows a graph of a typicaloperating point coefficient of performance at a Delta-T of 20° C.,wherein Delta-T is the temperature difference between thermal isolationchamber 336 and heat sink 114. The coefficient of performance is definedas the amount of heat transferred from thermal isolation chamber 336divided by the amount of power (voltage multiplied by current) requiredto operate thermoelectric transport or storage device 102. FIG. 29Bfurther shows the optimum operating point coefficient of performance ata Delta-T of 20° C. which corresponds to FIG. 29C showing the operatingpoint coefficient of performance of thermoelectric transport or storagedevice 102. As shown in FIG. 29A through FIG. 29C the operating pointcoefficient of performance for thermoelectric transport or storagedevice 102 is well above the typical operating point coefficient ofperformance. That is, thermoelectric transport or storage device 102 isable to pump more heat from thermal isolation chamber 336 to heat sink114 using less current and ultimately less power than typicalthermoelectric systems. Further improvements over typical thermoelectricsystems was also shown in FIG. 30A through FIG. 30C at a Delta-T of 40°C.

Although applicant has described applicant's preferred embodiments ofthis invention, it will be understood that the broadest scope of thisinvention includes modifications. Such scope is limited only by thebelow claims as read in connection with the above specification.Further, many other advantages of applicant's invention will be apparentto those skilled in the art from the above descriptions and the belowclaims.

What is claimed is:
 1. A thermal protection system, relating tothermally protecting temperature-sensitive goods, comprising: a vesselconfigured to contain the temperature sensitive goods; a stack of atleast two thermoelectric unit layers capable of active use of thePeltier effect in thermal conduction with the vessel, eachthermoelectric unit layer having a cold side and a hot side; acapacitance spacer block that stores heat and provides a thermal bufferto delay transfer of heat between the stack of at least twothermoelectric unit layers, wherein a first side of the capacitancespacer block is thermally connected to the hot side of a firstthermoelectric unit layer and a second side of the capacitance spacerblock opposite the first side of the capacitance spacer block isthermally connected to the cold side of a second thermoelectric unitlayer, thereby forming a sandwich layer that pumps heat from the firstthermoelectric unit layer to the second thermoelectric layer; an energysource operably connected to each of the at least two thermoelectricunit layers, wherein the energy source is suitable to provide a current,the stack of the at least two thermoelectric unit layers beingconfigured so that each individual thermoelectric unit layer has a ratioof input current to maximum available current (I/Imax) of 0.35 or lessat a steady-state when heat removal (Q) is about 0 Watts; and a heatsink associated with a fan assembly and thermally connected at an end ofthe stack of at least two thermoelectric unit layers opposite thevessel.
 2. The thermal protection system of claim 1, wherein the I/Imaxratio of each individual thermoelectric unit layer is 0.18 or less at asteady-state, when change in temperature (ΔT) of the stack of at leasttwo thermoelectric unit layers at opposing ends of the stack of at leasttwo thermoelectric unit layers is about 40° C. and heat (Q) is about 0Watts.
 3. The thermal protection system of claim 2, wherein the I/Imaxratio of each individual thermoelectric unit layer is 0.09 or less at asteady-state, when ΔT of the stack of at least two thermoelectric unitlayers at opposing ends of the stack of at least two thermoelectric unitlayers is about 20° C. and Q is about 0 Watts.
 4. The thermal protectionsystem of claim 1, wherein the temperature sensitive goods comprise:embryos, oocytes, cell cultures, tissue cultures, chondrocytes, nucleicacids, bodily fluids, bovine semen, organs, plant tissues,pharmaceuticals, vaccines, and chemicals.
 5. The thermal protectionsystem of claim 1, wherein the stack of at least two thermoelectric unitlayers is configured to operate when a temperature outside the stack ofat least two thermoelectric unit layers is in a range of −30° C. to 60°C.
 6. The thermal protection system of claim 1, wherein the capacitancespacer block separates the first thermoelectric unit layer and thesecond thermoelectric unit layer by a distance of at least 6.35 mm. 7.The thermal protection system of claim 1, wherein each of the at leasttwo thermoelectric unit layers comprises a two-dimensional surface areacomprising side distances between 40-62 mm and 40-62 mm.
 8. A thermalprotection system, relating to thermally protectingtemperature-sensitive goods, comprising: a vessel configured to containthe temperature sensitive goods; a stack of at least two thermoelectricunit layers in thermal conduction with the vessel and capable of activeuse of the Peltier effect, each thermoelectric unit layer having a coldside and a hot side; an energy source operably connected to eachthermoelectric unit layer, wherein the energy source is suitable toprovide a current, the stack of at least two thermoelectric unit layersbeing configured so that each individual thermoelectric unit layer has aratio of input current to maximum available current (I/Imax) of 0.18 orless at a steady-state when a change in temperature (ΔT) betweenopposing ends of the stack of at least two thermoelectric unit layers isless than or equal to about 40° C. and heat removal (Q) is about 0Watts; and a heat sink associated with a fan assembly and thermallyconnected to the stack of at least two thermoelectric unit layersopposite the vessel.
 9. The thermal protection system of claim 8,wherein the temperature sensitive goods comprise: embryos, oocytes, cellcultures, tissue cultures, chondrocytes, nucleic acids, bodily fluids,bovine semen, organs, plant tissues, pharmaceuticals, vaccines, andchemicals.
 10. The thermal protection system of claim 8, wherein theheat sink comprises a capacity in a range of 35 to 45 Watts.
 11. Thethermal protection system of claim 8, wherein the heat sink and thestack of at least two thermoelectric unit layers are configured suchthat at steady-state the heat sink has a temperature that does notexceed 30% of a heat sink maximum temperature rating.
 12. The thermalprotection system of claim 8, wherein the stack of at least twothermoelectric unit layers is configured to minimize a temperature riseor drop on the heat sink at steady-state so that the temperature rise ordrop on the heat sink does not exceed 3° C.
 13. The thermal protectionsystem of claim 8, wherein each thermoelectric unit layer comprisessubstantially a same size and substantially a same heat pumpingcapability.
 14. A thermal protection system, relating to thermallyprotecting temperature-sensitive goods, comprising: a vessel configuredto contain the temperature sensitive goods; a stack of at least twothermoelectric unit layers in thermal conduction with the vessel andcapable of active use of the Peltier effect, each thermoelectric unitlayer comprising 3 or more Ohms at 25° C., each thermoelectric unitlayer having a cold side and a hot side; a capacitance spacer blocksuitable for storing heat and providing a delayed thermal reaction timebetween the at least two thermoelectric unit layers, wherein a firstside of the capacitance spacer block is thermally connected to the hotside of a first thermoelectric unit layer and a second side of thecapacitance spacer block opposite the first side of the capacitancespacer block is thermally connected to the cold side of a secondthermoelectric unit layer, thereby forming a sandwich layer suitable topump heat from the first thermoelectric unit layer to the secondthermoelectric layer; an energy source operably connected to eachthermoelectric unit layer; and a heat sink thermally connected to thestack of at least two thermoelectric unit layers opposite the vessel.15. The thermal protection system of claim 14, wherein the energy sourceis suitable to provide a current such that when a change in temperature(ΔT) between opposing ends of the stack of at least two thermoelectricunit layers is less than or equal to about 40° C. at a steady-state, theheat removal (Q) is about 0 Watts.
 16. The thermal protection system ofclaim 15, wherein a ratio of input current to maximum available current(I/Imax) of each individual thermoelectric unit layer is 0.18 or less atsteady-state.
 17. The thermal protection system of claim 14, wherein thetemperature sensitive goods include: embryos, oocytes, cell cultures,tissue cultures, chondrocytes, nucleic acids, bodily fluids, bovinesemen, organs, plant tissues, pharmaceuticals, vaccines, and chemicals.18. The thermal protection system of claim 14, wherein eachthermoelectric unit layer comprises at least 127 coupled pairs ofthermoelectric units.
 19. The thermal protection system of claim 14,wherein the two or more thermoelectric unit layers comprise a same sizeand power.
 20. The thermal protection system of claim 14, wherein theenergy source comprises at least one battery that is suitable tomaintain a selected temperature for the temperature sensitive goodsduring transport of at least 72 hours, wherein a difference between theselected temperature of the temperature sensitive goods and an ambienttemperature is at least 20° C.